General
Property | Temperature | Value |
---|---|---|
Density | 23.0 °C | 2.05 g/cm³ Show Supplier Material materials with Density of 2.05 g/cm³ |
Mechanical
Property | Temperature | Value |
---|---|---|
Elastic modulus | 23.0 °C | 289 GPa Show Supplier Material materials with Elastic modulus of 289 GPa |
Thermal
Property | Temperature | Value | Comment |
---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 9.5E-6 - 1.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 9.5E-6 - 1.1E-5 1/K | ASTM E228, ASTM E289 |
Specific heat capacity | 23.0 °C | 6615 J/(kg·K) Show Supplier Material materials with Specific heat capacity of 6615 J/(kg·K) | |
Thermal conductivity | 23.0 °C | 200 W/(m·K) Show Supplier Material materials with Thermal conductivity of 200 W/(m·K) | |
Thermal diffusivity | 23.0 °C | 14.78 mm²/s Show Supplier Material materials with Thermal diffusivity of 14.78 mm²/s |
Chemical properties
Property | Value |
---|---|
Beryllium | BeO: 25.8-32.25% |
Technological properties
Property | ||
---|---|---|
Application areas | Microelectronics - electronic heat sinks and chill plates, Aerospace - aerospace applications and components, Semiconductor - power devices |