E-20 Beryllium

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Beryllium and beryllium oxide metal matrix composites provide outstanding stiffness-to-weight ratios with thermal cycle reliability over a broad temperature range. The high elastic modulus of helps absorb vibrations, lowering the material fatigue of attached modules and wire bonds.

E-Materials offer high thermal conductivity and low thermal expansion. Their thermal expansion can be adjusted to match that of other materials, such as silicon, gallium arsenide and various ceramics. Features include:

  • Low weight - density
  • High strength
  • High modulus
  • Excellent thermal expansion
  • Excellent thermal conductivity

  • This material data has been provided by Materion Brush GmbH.

    All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
    Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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    23.0 °C

    2.05 g/cm³

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    Elastic modulus

    23.0 °C

    289 GPa

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    Coefficient of thermal expansion

    23.0 °C

    9.5E-6 - 1.1E-5 1/K

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    ASTM E228, ASTM E289

    Specific heat capacity

    23.0 °C

    6615 J/(kg·K)

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    Thermal conductivity

    23.0 °C

    200 W/(m·K)

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    Thermal diffusivity

    23.0 °C

    14.78 mm²/s

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    Chemical properties



    BeO: 25.8-32.25%

    Technological properties

    Application areas

    Microelectronics - electronic heat sinks and chill plates, Aerospace - aerospace applications and components, Semiconductor - power devices