E-40 Beryllium

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Description

Beryllium and beryllium oxide metal matrix composites provide outstanding stiffness-to-weight ratios with thermal cycle reliability over a broad temperature range. The high elastic modulus of helps absorb vibrations, lowering the material fatigue of attached modules and wire bonds.


E-Materials offer high thermal conductivity and low thermal expansion. Their thermal expansion can be adjusted to match that of other materials, such as silicon, gallium arsenide and various ceramics. Features include:


  • Low weight - density
  • High strength
  • High modulus
  • Excellent thermal expansion
  • Excellent thermal conductivity

  • This material data has been provided by Materion Brush GmbH.

    "Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
    All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
    Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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    Properties

    General

    PropertyTemperatureValue

    Density

    23.0 °C

    2.28 g/cm³

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    Mechanical

    PropertyTemperatureValue

    Elastic modulus

    23.0 °C

    302 GPa

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    Thermal

    PropertyTemperatureValueComment

    Coefficient of thermal expansion

    23.0 °C

    8E-6 - 9.5E-6 1/K

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    ASTM E228, ASTM E289

    Specific heat capacity

    23.0 °C

    5890 J/(kg·K)

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    Thermal conductivity

    23.0 °C

    205 W/(m·K)

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    Thermal diffusivity

    23.0 °C

    15.29 mm²/s

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    Chemical properties

    PropertyValue

    Beryllium

    BeO: 49.5-54.8%

    Technological properties

    Property
    Application areas

    Microelectronics - electronic heat sinks and chill plates, Aerospace - aerospace applications and components, Semiconductor - power devices