EN 12165 Grade Cu-DHP H040

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Description

Cu-DHP, mat. No CW024A, is a phosphoric pure copper grade. To the comparable DIN-mark SF-Cu, mat. No 2.0090 acc. to DIN 1787 applies: The material is a deoxidized copper with Cu >= 99,9% and a high residual copper-content. Tensile strength and Brinell hardness are increasable by cold forming. SF-Cu (Cu-DHP) is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: SF-Cu is the most important copper-grade for pipes due to its very good soldering and welding properties. Further application in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

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Equivalent Materials

This material data has been provided by WIAM.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

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Mechanical

PropertyTemperatureValueComment

Elastic modulus

-253.0 °C

138 GPa

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-195.0 °C

136 GPa

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-100.0 °C

133 GPa

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20.0 °C

128 - 132 GPa

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50.0 °C

127 GPa

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100.0 °C

125 GPa

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150.0 °C

122 GPa

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200.0 °C

120 GPa

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250.0 °C

118 GPa

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Elongation

20.0 °C

30 %

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Elongation A100

20.0 °C

30 %

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Hardness, Brinell

20.0 °C

40 [-]

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Hardness, Vickers

20.0 °C

40 - 65 [-]

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Poisson's ratio

20.0 °C

0.34 [-]

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Shear modulus

23.0 °C

48 GPa

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Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

200 MPa

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Yield strength Rp0.2

20.0 °C

50 MPa

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Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.68E-5 1/K

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200.0 °C

1.73E-5 1/K

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300.0 °C

1.77E-5 1/K

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Melting point

965 - 1100 °C

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Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

-150.0 °C

282 J/(kg·K)

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-50.0 °C

361 J/(kg·K)

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20.0 °C

386 J/(kg·K)

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100.0 °C

393 J/(kg·K)

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200.0 °C

403 J/(kg·K)

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300.0 °C

415 J/(kg·K)

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Thermal conductivity

20.0 °C

305 - 340 W/(m·K)

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50.0 °C

310 W/(m·K)

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100.0 °C

318 W/(m·K)

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200.0 °C

326 W/(m·K)

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300.0 °C

334 W/(m·K)

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Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

4.30E+7 S/m

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50.0 °C

4.10E+7 S/m

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100.0 °C

3.70E+7 S/m

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200.0 °C

3.40E+7 S/m

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300.0 °C

3.00E+7 S/m

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Electrical resistivity

20.0 °C

2.2E-8 Ω·m

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50.0 °C

2.4E-8 Ω·m

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100.0 °C

2.7E-8 Ω·m

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200.0 °C

2.9E-8 Ω·m

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300.0 °C

3.3E-8 Ω·m

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Chemical properties

PropertyValue

Copper

99.9 %

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Phosphorus

0.02 - 0.04 %

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Silver

0.02 %

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