EN 12163 Grade Cu-DHP H085

Want to keep this datasheet? Save it now in your required format

Description

Cu-DHP, mat. No CW024A, is a phosphoric pure copper grade. To the comparable DIN-mark SF-Cu, mat. No 2.0090 acc. to DIN 1787 applies: The material is a deoxidized copper with Cu >= 99,9% and a high residual copper-content. Tensile strength and Brinell hardness are increasable by cold forming. SF-Cu (Cu-DHP) is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: SF-Cu is the most important copper-grade for pipes due to its very good soldering and welding properties. Further application in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Related Standards

Equivalent Materials

This material data has been provided by WIAM.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

Show Material materials with Density of 8.9 - 8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

95 - 98 GPa

Show Material materials with Elastic modulus of 95 - 98 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Hardness, Brinell

20.0 °C

85 - 110 [-]

Show Material materials with Hardness, Brinell of 85 - 110 [-]

Hardness, Vickers

20.0 °C

90 - 115 [-]

Show Material materials with Hardness, Vickers of 90 - 115 [-]

Poisson's ratio

23.0 °C

0.34 [-]

Show Material materials with Poisson's ratio of 0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Show Material materials with Shear modulus of 48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.68E-5 1/K

Show Material materials with Coefficient of thermal expansion of 1.68E-5 1/K

200.0 °C

1.73E-5 1/K

Show Material materials with Coefficient of thermal expansion of 1.73E-5 1/K

300.0 °C

1.77E-5 1/K

Show Material materials with Coefficient of thermal expansion of 1.77E-5 1/K

Melting point

965 - 1100 °C

Show Material materials with Melting point of 965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

-150.0 °C

282 J/(kg·K)

Show Material materials with Specific heat capacity of 282 J/(kg·K)

-50.0 °C

361 J/(kg·K)

Show Material materials with Specific heat capacity of 361 J/(kg·K)

20.0 °C

386 J/(kg·K)

Show Material materials with Specific heat capacity of 386 J/(kg·K)

100.0 °C

393 J/(kg·K)

Show Material materials with Specific heat capacity of 393 J/(kg·K)

200.0 °C

403 J/(kg·K)

Show Material materials with Specific heat capacity of 403 J/(kg·K)

300.0 °C

415 J/(kg·K)

Show Material materials with Specific heat capacity of 415 J/(kg·K)

Unlock all property charts

Thermal conductivity

20.0 °C

305 W/(m·K)

Show Material materials with Thermal conductivity of 305 W/(m·K)

50.0 °C

310 W/(m·K)

Show Material materials with Thermal conductivity of 310 W/(m·K)

100.0 °C

318 W/(m·K)

Show Material materials with Thermal conductivity of 318 W/(m·K)

200.0 °C

326 W/(m·K)

Show Material materials with Thermal conductivity of 326 W/(m·K)

300.0 °C

334 W/(m·K)

Show Material materials with Thermal conductivity of 334 W/(m·K)

Unlock all property charts

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

4.30E+7 S/m

Show Material materials with Electrical conductivity of 4.30E+7 S/m

50.0 °C

4.10E+7 S/m

Show Material materials with Electrical conductivity of 4.10E+7 S/m

100.0 °C

3.70E+7 S/m

Show Material materials with Electrical conductivity of 3.70E+7 S/m

200.0 °C

3.40E+7 S/m

Show Material materials with Electrical conductivity of 3.40E+7 S/m

300.0 °C

3.00E+7 S/m

Show Material materials with Electrical conductivity of 3.00E+7 S/m

Unlock all property charts

Electrical resistivity

20.0 °C

2.2E-8 Ω·m

Show Material materials with Electrical resistivity of 2.2E-8 Ω·m

50.0 °C

2.4E-8 Ω·m

Show Material materials with Electrical resistivity of 2.4E-8 Ω·m

100.0 °C

2.7E-8 Ω·m

Show Material materials with Electrical resistivity of 2.7E-8 Ω·m

200.0 °C

2.9E-8 Ω·m

Show Material materials with Electrical resistivity of 2.9E-8 Ω·m

300.0 °C

3.3E-8 Ω·m

Show Material materials with Electrical resistivity of 3.3E-8 Ω·m

Unlock all property charts

Chemical properties

PropertyValue

Copper

99.9 %

Show Material materials with Copper of 99.9 %

Phosphorus

0.02 - 0.04 %

Show Material materials with Phosphorus of 0.02 - 0.04 %