LNP™ STAT-LOY™ Compound 63000CT

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Description

A permanent antistatic PC-Alloy compound that features transparency and superior cleanliness for advanced semiconductor packaging applications

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electrical Engineering

Electronics

Display Devices

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See all materials by this supplier

Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.16 g/cm³ Show Supplier Material materials with Density of 1.16 g/cm³	ASTM D 792
Moisture absorption	23.0 °C	0.7 % Show Supplier Material materials with Moisture absorption of 0.7 %	ISO 62 \| (23°C / 50% RH)

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	1.2 GPa Show Supplier Material materials with Elastic modulus of 1.2 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	140 % Show Supplier Material materials with Elongation of 140 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	1.1 GPa Show Supplier Material materials with Flexural modulus of 1.1 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	50 MPa Show Supplier Material materials with Flexural strength of 50 MPa	ASTM D 790 \| brk, 1.3 mm/min, 50 mm span
Impact strength, Charpy notched	23.0 °C	69 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 69 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Izod notched	23.0 °C	580 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 580 kJ/m²	ASTM D 256 \| notched, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	580 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 580 J/m	ASTM D 256 \| notched, 23°C
Tensile strength	23.0 °C	34 MPa Show Supplier Material materials with Tensile strength of 34 MPa	ISO 527 \| yield, 5 mm/min

Thermal

Property	Value	Comment
Heat deflection temperature	68 - 83 °C Show Supplier Material materials with Heat deflection temperature of 68 - 83 °C
Heat deflection temperature, 0.45 MPa	83 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 83 °C	ASTM D 648 \| 6.4 mm, unannealed
Heat deflection temperature, 1.80 MPa	68 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 68 °C	ISO 75/Af \| Flatw 80104 sp=64mm

Electrical

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	1.00E+11 - 5.00E+12 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+11 - 5.00E+12 Ω	ASTM D 257
Volume resistivity	23.0 °C	1.00E+11 - 5.00E+12 Ω·cm Show Supplier Material materials with Volume resistivity of 1.00E+11 - 5.00E+12 Ω·cm	ASTM D 257

Optical

Property	Value	Comment
Haze	10 % Show Supplier Material materials with Haze of 10 %	ASTM D 1003 \| 2.54 mm
Transmission	81 % Show Supplier Material materials with Transmission of 81 %	ASTM D 1003 \| 2.54 mm

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		16 g/10min Show Supplier Material materials with Melt mass-flow rate of 16 g/10min	ASTM D 1238 \| 260°C/2.16 kgf
Shrinkage	23.0 °C	0.6 % Show Supplier Material materials with Shrinkage of 0.6 %	SABIC method
Shrinkage, transverse	23.0 °C	0.6 % Show Supplier Material materials with Shrinkage, transverse of 0.6 %	SABIC method

Technological properties

Property
Application areas	Personal Computing, Semiconductor, Data Management, Electronic Components
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 90 to 95.0°C Drying Time: 6 to 8.0hrs Melt Temperature: 230 to 250.0°C Nozzle Temperature: 230 to 250.0°C Front - Zone 3 Temperature: 230 to 250.0°C Middle - Zone 2 Temperature: 225 to 240.0°C Rear - Zone 1 Temperature: 220 to 230.0°C Mold Temperature: 40 to 50.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.