LNP™ STAT-LOY™ Compound 63000CT

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Description

A permanent antistatic PC-Alloy compound that features transparency and superior cleanliness for advanced semiconductor packaging applications

This material data has been provided by Sabic.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.16 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.7 %

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ISO 62 | (23°C / 50% RH)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

1.18 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

140 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

1.14 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

50 MPa

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ASTM D 790 | brk, 1.3 mm/min, 50 mm span

Impact strength, Charpy notched

23.0 °C

69 kJ/m²

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ISO 179/2C | 23°C

Impact strength, Izod notched

23.0 °C

580 kJ/m²

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ASTM D 256 | notched, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

580 J/m

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ASTM D 256 | notched, 23°C

Tensile strength

23.0 °C

34 MPa

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ISO 527 | yield, 5 mm/min

Thermal

PropertyValueComment

Heat deflection temperature

68 - 83 °C

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Heat deflection temperature, 0.45 MPa

83 °C

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ASTM D 648 | 6.4 mm, unannealed

Heat deflection temperature, 1.80 MPa

68 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Electrical

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+11 - 5.00E+12 Ω

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ASTM D 257

Volume resistivity

23.0 °C

1.00E+11 - 5.00E+12 Ω·cm

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ASTM D 257

Optical

PropertyValueComment

Haze

10 %

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ASTM D 1003 | 2.54 mm

Transmission

81 %

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ASTM D 1003 | 2.54 mm

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

16 g/10min

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ASTM D 1238 | 260°C/2.16 kgf

Shrinkage

23.0 °C

0.6 %

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SABIC method

Shrinkage, transverse

23.0 °C

0.6 %

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SABIC method

Technological properties

Property
Application areas

Personal Computing, Semiconductor, Data Management, Electronic Components

Availability

Europe,Asia,Americas

Features

Antistatic, Transparent

Processing methods

Drying Temperature: 90 to 95.0°C
Drying Time: 6 to 8.0hrs
Melt Temperature: 230 to 250.0°C
Nozzle Temperature: 230 to 250.0°C
Front - Zone 3 Temperature: 230 to 250.0°C
Middle - Zone 2 Temperature: 225 to 240.0°C
Rear - Zone 1 Temperature: 220 to 230.0°C
Mold Temperature: 40 to 50.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.