LNP™ KONDUIT™ Compound PX11311 - Asia

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Description

LNP KONDUIT PX11311 is a compound based on PA6 resin containing mineral and glass fiber. Added features include thermally conductive, electrically insulative and non-brominated, non-chlorinated FR.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electrical Engineering

Electronics

Display Devices

Construction

Lighting

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LNP™ ELCRES™ CRX9411

See all materials by this supplier

Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.74 g/cm³ Show Supplier Material materials with Density of 1.74 g/cm³	ASTM D 792

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	7.2 GPa Show Supplier Material materials with Elastic modulus of 7.2 GPa	ASTM D 638 \| 5 mm/min
Elongation	23.0 °C	2 % Show Supplier Material materials with Elongation of 2 %	ASTM D 638 \| brk, Type I, 5 mm/min
Flexural modulus	23.0 °C	9 GPa Show Supplier Material materials with Flexural modulus of 9 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Flexural strength	23.0 °C	76 MPa Show Supplier Material materials with Flexural strength of 76 MPa	ASTM D 790 \| brk, 1.3 mm/min, 50 mm span
Impact strength, Izod notched	23.0 °C	43 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 43 kJ/m²	ASTM D 256 \| notched, 23°C
Tensile strength	23.0 °C	52 MPa Show Supplier Material materials with Tensile strength of 52 MPa	ASTM D 638 \| brk, Type I, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	1.94E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.94E-5 1/K	ASTM E 831 \| 40°C to 120°C
Coefficient of thermal expansion, transverse	23.0 °C	4.59E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 4.59E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		199 °C Show Supplier Material materials with Heat deflection temperature of 199 °C
Heat deflection temperature, 1.80 MPa		199 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 199 °C	ASTM D 648 \| 6.4 mm, unannealed
Thermal conductivity	23.0 °C	1.38 W/(m·K) Show Supplier Material materials with Thermal conductivity of 1.38 W/(m·K)	ISO 22007-2 \| ?80*3mm discs
Thermal conductivity, through-plane	23.0 °C	1.1 W/(m·K) Show Supplier Material materials with Thermal conductivity, through-plane of 1.1 W/(m·K)	ISO 22007-2 \| ?80*3mm discs

Technological properties

Property
Application areas	Electronic Components, Wiring Devices, Wireless Communications, LED Lighting, Medical Device, Personal Computing
Availability	Asia
Processing methods	Drying Temperature: 80°C Maximum Moisture Content: 0.15 to 0.25% Drying Time: 4hrs Middle - Zone 2 Temperature: 270 to 290.0°C Screw Speed: 20 to 60.0rpm Front - Zone 3 Temperature: 270 to 290.0°C Melt Temperature: 270 to 295.0°C Back Pressure: 0.2 to 0.3MPa Rear - Zone 1 Temperature: 260 to 275.0°C Mold Temperature: 85 to 100.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.