General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.76 g/cm³ Show Supplier Material materials with Density of 1.76 g/cm³ | ISO 1183 |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 12.5 GPa Show Supplier Material materials with Elastic modulus of 12.5 GPa | ISO 527 | 1 mm/min |
Elongation | 23.0 °C | 1.5 % Show Supplier Material materials with Elongation of 1.5 % | ISO 527 | break, 5 mm/min |
Flexural modulus | 23.0 °C | 11 GPa Show Supplier Material materials with Flexural modulus of 11 GPa | ISO 178 | 2 mm/min |
Flexural strength | 23.0 °C | 164 MPa Show Supplier Material materials with Flexural strength of 164 MPa | ISO 178 | yield, 2 mm/min |
Impact strength, Izod notched | 23.0 °C | 3 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 3 kJ/m² | ISO 180/1A | notched 80*10*4, 23°C |
Tensile strength | 23.0 °C | 102 MPa Show Supplier Material materials with Tensile strength of 102 MPa | ISO 527 | break, 5 mm/min |
Thermal
Property | Temperature | Value | Comment |
---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 3.72E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 3.72E-5 1/K | ISO 11359-2 | 23°C to 80°C |
Coefficient of thermal expansion, transverse | 23.0 °C | 7.34E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7.34E-5 1/K | ISO 11359-2 | 23°C to 80°C |
Heat deflection temperature | 185 °C Show Supplier Material materials with Heat deflection temperature of 185 °C | ||
Heat deflection temperature, 1.80 MPa | 185 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 185 °C | ISO 75/Af | Flatw 80*10*4 sp=64mm | |
Thermal conductivity | 23.0 °C | 1.3 W/(m·K) Show Supplier Material materials with Thermal conductivity of 1.3 W/(m·K) | ISO 22007-2 | ?80*3mm discs |
Thermal conductivity, through-plane | 23.0 °C | 0.99 W/(m·K) Show Supplier Material materials with Thermal conductivity, through-plane of 0.99 W/(m·K) | ISO 22007-2 | ?80*3mm discs |
Technological properties
Property | ||
---|---|---|
Application areas | Electronic Components, Wiring Devices, Wireless Communications, LED Lighting, Medical Device, Personal Computing | |
Availability | Asia | |
Processing methods | Back Pressure: 0.2 to 0.3MPa | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |