LNP™ THERMOCOMP™ Compound LF004EX1

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Description

LNP THERMOCOMP LF004E is a high performance thermoplastic compound based on Polyetheretherketone (PEEK) resin containing 20% Glass Fiber. Added features of this material include: Easy Molding and Low Warpage

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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SABIC

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Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electrical Engineering

Automotive

Aerospace

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.43 g/cm³ Show Supplier Material materials with Density of 1.43 g/cm³	ASTM D 792
Moisture absorption	23.0 °C	0.1 % Show Supplier Material materials with Moisture absorption of 0.1 %	<, ISO 62 \| (23°C / 50% RH)
Relative density	23.0 °C	1.43 [-] Show Supplier Material materials with Relative density of 1.43 [-]	ASTM D 792 \|

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	8.9 GPa Show Supplier Material materials with Elastic modulus of 8.9 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	2.1 % Show Supplier Material materials with Elongation of 2.1 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	7.4 GPa Show Supplier Material materials with Flexural modulus of 7.4 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	200 MPa Show Supplier Material materials with Flexural strength of 200 MPa	ISO 178 \| 2 mm/min
Impact strength, Charpy notched	23.0 °C	8.1 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 8.1 kJ/m²	ISO 179/1eA \| V-notch Edgew 80104 sp=62mm, 23°C
Impact strength, Izod notched	23.0 °C	8 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 8 kJ/m²	ISO 180/1A \| 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	70 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 70 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched	23.0 °C	36 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 36 kJ/m²	ISO 180/1U \| unnotched 80104, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	560 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 560 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	135 MPa Show Supplier Material materials with Tensile strength of 135 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	2.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2.5E-5 1/K	ASTM E 831 \| -40°C to 120°C
Coefficient of thermal expansion, transverse	23.0 °C	5.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 5.5E-5 1/K	ASTM E 831 \| -40°C to 120°C
Heat deflection temperature		305 - 330 °C Show Supplier Material materials with Heat deflection temperature of 305 - 330 °C
Heat deflection temperature, 0.45 MPa		330 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 330 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		305 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 305 °C	ISO 75/Af \| Flatw 80104 sp=64mm

Electrical

Property	Temperature	Value	Comment
Dielectric constant	23.0 °C	3.5 [-] Show Supplier Material materials with Dielectric constant of 3.5 [-]	SABIC method \| 1.9 GHz
Dielectric constant, 1GHz	23.0 °C	3.48 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.48 [-]	SABIC method \| 1.1 GHz
Dissipation factor	23.0 °C	3.4E-3 [-] Show Supplier Material materials with Dissipation factor of 3.4E-3 [-]	SABIC method
Dissipation factor, 1GHz	23.0 °C	3.2E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 3.2E-3 [-]	SABIC method \|

Rheological Properties

Property	Temperature	Value	Comment
Shrinkage	23.0 °C	0.4 % Show Supplier Material materials with Shrinkage of 0.4 %	ASTM D 955 \| 24 hrs
Shrinkage, transverse	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage, transverse of 0.5 %	ASTM D 955 \| 24 hrs

Technological properties

Property
Application areas	Oil/Gas, Electronic Components, Enclosures, Heavy Vehicles, Air Cabin Interiors
Availability	Europe,Asia,Americas
Processing methods	Drying Time: 3 to 5.0hrs Front - Zone 3 Temperature: 370 to 380.0°C Middle - Zone 2 Temperature: 360 to 370.0°C Rear - Zone 1 Temperature: 290 to 300.0°C Mold Temperature: 170 to 200.0°C Screw Speed: 50 to 100.0rpm Melt Temperature: 380 to 400.0°C Nozzle Temperature: 380 to 400.0°C Drying Temperature: 120 to 150.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.