LNP™ STAT-KON™ Compound EX07311P

Want to keep this datasheet? Save it now in your required format

Description

LNP STAT-KON* EX07311P is an easy flowing ESD-safe compound based on Polyetherimide resin. This compound is developed for good dimensional stability for use in ESD Tray for Backend Semicon and HDD tray applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

All categories

Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electrical Engineering

Electronics

Display Devices

Materials by this supplier

LNP™ THERMOCOMP™ Compound WF006H

LNP™ THERMOCOMP™ Compound PF00C - Europe

LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

See all materials by this supplier

Properties

General

Property	Temperature	Value	Comment
Coefficient of friction		0.4 [-] Show Supplier Material materials with Coefficient of friction of 0.4 [-]
Coefficient of friction, kinetic		0.4 [-] Show Supplier Material materials with Coefficient of friction, kinetic of 0.4 [-]	ASTM D 3702 Modified: Manual
Density	23.0 °C	1.56 g/cm³ Show Supplier Material materials with Density of 1.56 g/cm³	ISO 1183

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	15.2 GPa Show Supplier Material materials with Elastic modulus of 15.2 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	1.9 % Show Supplier Material materials with Elongation of 1.9 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	13.2 GPa Show Supplier Material materials with Flexural modulus of 13.2 GPa	ISO 178 \| 2 mm/min
Flexural strain	23.0 °C	1.7 % Show Supplier Material materials with Flexural strain of 1.7 %	ISO 178 \| break, 2 mm/min
Flexural strength	23.0 °C	203 MPa Show Supplier Material materials with Flexural strength of 203 MPa	ISO 178 \| yield, 2 mm/min
Impact strength, Izod notched	23.0 °C	6 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 6 kJ/m²	ISO 180/1A \| 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	56 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 56 J/m	ASTM D 256 \| notched, 23°C
Tensile strength	23.0 °C	174 MPa Show Supplier Material materials with Tensile strength of 174 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	8.9E-6 1/K Show Supplier Material materials with Coefficient of thermal expansion of 8.9E-6 1/K	ASTM E 831 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	4.38E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 4.38E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		204 °C Show Supplier Material materials with Heat deflection temperature of 204 °C
Heat deflection temperature, 1.80 MPa		204 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 204 °C	ISO 75/Af \| Flatw 80104 sp=64mm

Electrical

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	100000 - 1000000 Ω Show Supplier Material materials with Sheet resistivity, ROA of 100000 - 1000000 Ω	IEC 60093
Volume resistivity	23.0 °C	100000 - 1000000 Ω·cm Show Supplier Material materials with Volume resistivity of 100000 - 1000000 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Melt volume-flow rate		30 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 30 cm³/10min	ISO 1133 \| MVR at 345°C/10.0 kg
Shrinkage	23.0 °C	0.29 % Show Supplier Material materials with Shrinkage of 0.29 %	SABIC method
Shrinkage, transverse	23.0 °C	0.36 % Show Supplier Material materials with Shrinkage, transverse of 0.36 %	SABIC method

Technological properties

Property
Application areas	Data Management, Circuit Protection, Semiconductor
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 150°C Drying Time: 4 to 6.0hrs Maximum Moisture Content: 0.02% Melt Temperature: 360 to 375.0°C Nozzle Temperature: 365 to 375.0°C Front - Zone 3 Temperature: 365 to 375.0°C Middle - Zone 2 Temperature: 360 to 370.0°C Rear - Zone 1 Temperature: 355 to 365.0°C Mold Temperature: 140 to 180.0°C Back Pressure: 0.3 to 0.7MPa Vent Depth: 0.025 to 0.076mm Screw speed (Circumferential speed): 0.2 to 0.3m/s
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.