General
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 3.6 GPa Show Supplier Material materials with Elastic modulus of 3.6 GPa | ASTM D 638 | 5 mm/min |
Elongation | 23.0 °C | 7 % Show Supplier Material materials with Elongation of 7 % | ASTM D 638 | yld, Type I, 5 mm/min |
Flexural modulus | 23.0 °C | 3.5 GPa Show Supplier Material materials with Flexural modulus of 3.5 GPa | ASTM D 790 | 2.6 mm/min, 100 mm span |
Flexural strength | 23.0 °C | 165 MPa Show Supplier Material materials with Flexural strength of 165 MPa | ASTM D 790 | yld, 2.6 mm/min, 100 mm span |
Hardness, Rockwell M | 23.0 °C | 109 [-] Show Supplier Material materials with Hardness, Rockwell M of 109 [-] | ASTM D 785 | |
Impact strength, Izod notched | 23.0 °C | 32 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 32 kJ/m² | ASTM D 256 | notched, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 32 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 32 J/m | ASTM D 256 | notched, 23°C |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 1335 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 1335 J/m | ASTM D 4812 | 23°C |
Tensile strength | 23.0 °C | 110 MPa Show Supplier Material materials with Tensile strength of 110 MPa | ASTM D 638 | yld, Type I, 5 mm/min |
Thermal
Property | Temperature | Value | Comment | ||
---|---|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 5.58E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 5.58E-5 1/K | ASTM E 831 | -20°C to 150°C | ||
Heat deflection temperature | 198 - 207 °C Show Supplier Material materials with Heat deflection temperature of 198 - 207 °C | ||||
Heat deflection temperature, 0.45 MPa | 207 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 207 °C | ASTM D 648 | 6.4 mm, unannealed | |||
Heat deflection temperature, 1.80 MPa | 198 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 198 °C | ASTM D 648 | 6.4 mm, unannealed | |||
Relative temperature index, electrical | 105 °C Show Supplier Material materials with Relative temperature index, electrical of 105 °C | UL 746B | |||
Relative temperature index, mechanical impact | 105 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 105 °C | UL 746B | |||
Relative temperature index, mechanical strength | 105 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 105 °C | UL 746B | |||
Thermal conductivity | 23.0 °C | 0.22 W/(m·K) Show Supplier Material materials with Thermal conductivity of 0.22 W/(m·K) | ASTM C177 | ||
Flammability | UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101282876- - <br> UL Recognized, 94V-0 Flame Class Rating: 1.5mm UL 94 |
Electrical
Property | Temperature | Value | Comment |
---|---|---|---|
Volume resistivity | 23.0 °C | 1.00E+17 Ω·cm Show Supplier Material materials with Volume resistivity of 1.00E+17 Ω·cm | ASTM D 257 |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Shrinkage | 23.0 °C | 0.5 % Show Supplier Material materials with Shrinkage of 0.5 % | SABIC method | 3.2 mm |
Technological properties
Property | ||
---|---|---|
Application areas | Surgical Devices | |
Availability | Europe,Asia,Americas | |
Processing methods | Drying Temperature: 150°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |