LNP™ THERMOCOMP™ Compound FX10009

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Description

LNP THERMOCOMP FX10009 is a compound based on Polyethylene resin, containing Mineral. Added features include: Improved Dielectric Properties.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

2.5 g/cm³

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ISO 1183

Water absorption

23.0 °C

0.08 %

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ISO 62-1 | (23°C/24hrs)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.6 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

1.2 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

2.8 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

15 MPa

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ISO 178 | break, 2 mm/min

Impact strength, Izod notched

23.0 °C

3.5 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Impact strength, Izod unnotched

23.0 °C

5.5 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Tensile strength

23.0 °C

20 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.3E-4 1/K

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ISO 11359-2 | 23°C to 60°C

Coefficient of thermal expansion, transverse

23.0 °C

1.5E-4 1/K

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ISO 11359-2 | 23°C to 60°C

Heat deflection temperature

60 - 100 °C

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Heat deflection temperature, 0.45 MPa

100 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

60 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Electrical

PropertyTemperatureValueComment

Dielectric constant, 100MHz

23.0 °C

13.6 [-]

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IEC 60250 | 100 MHz

Dielectric constant, 1GHz

23.0 °C

13.1 [-]

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IEC 60250

Dielectric constant, 500MHz

23.0 °C

13.4 [-]

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IEC 60250

Dissipation factor, 100MHz

23.0 °C

9E-3 [-]

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IEC 60250 | 100 MHz

Dissipation factor, 1GHz

23.0 °C

8E-3 [-]

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IEC 60250

Dissipation factor, 500MHz

23.0 °C

8E-3 [-]

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IEC 60250

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

7.5 cm³/10min

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ISO 1133 | MVR at 190°C/10.0 kg

Shrinkage

23.0 °C

1.5 %

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SABIC method

Technological properties

Property
Application areas

Enclosures

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 80°C
Drying Time: 4hrs
Maximum Moisture Content: 0.03%
Melt Temperature: 210 to 215.0°C
Front - Zone 3 Temperature: 205 to 215.0°C
Middle - Zone 2 Temperature: 200 to 210.0°C
Rear - Zone 1 Temperature: 190 to 200.0°C
Mold Temperature: 15 to 55.0°C
Back Pressure: 0.2 to 0.3MPa
Screw Speed: 30 to 60.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.