LNP™ STAT-KON™ Compound DX05301C

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Description

LNP STAT-KON DX05301C is a compound based on Polycarbonate containing Proprietary Filler(s). Added features of this material include: Clean Compounding System, Electrically Conductive, Low Ionic, Low Outgassing, Low LPC and ESD safe. Suitable for Semiconductor and Hard Disk Drive (HDD) Applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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SABIC

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Applications

Electrical Engineering

Electronics

Display Devices

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.22 g/cm³ Show Supplier Material materials with Density of 1.22 g/cm³	ISO 1183
Relative density	23.0 °C	1.22 [-] Show Supplier Material materials with Relative density of 1.22 [-]	ASTM D 792 \|

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	2.5 GPa Show Supplier Material materials with Elastic modulus of 2.5 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	1.5 % Show Supplier Material materials with Elongation of 1.5 %	ISO 527 \| yield, 5 mm/min
Flexural modulus	23.0 °C	2.5 GPa Show Supplier Material materials with Flexural modulus of 2.5 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	77 MPa Show Supplier Material materials with Flexural strength of 77 MPa	ISO 178 \| yield, 2 mm/min
Impact strength, Izod notched	23.0 °C	5 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 5 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	54 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 54 J/m	ASTM D 256 \| notched, 23°C
Tensile strength	23.0 °C	56 MPa Show Supplier Material materials with Tensile strength of 56 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Value	Comment
Heat deflection temperature	131 °C Show Supplier Material materials with Heat deflection temperature of 131 °C
Heat deflection temperature, 1.80 MPa	131 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 131 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Relative temperature index, electrical	80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C	UL 746B
Relative temperature index, mechanical impact	80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C	UL 746B
Relative temperature index, mechanical strength	80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C	UL 746B
Vicat softening temperature	146 °C Show Supplier Material materials with Vicat softening temperature of 146 °C	ISO 306 \| Rate B/120
Flammability	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101282790- - <br> UL Recognized, 94HB Flame Class Rating: ≥1mm UL 94 <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=101282790- -

Electrical

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	1.00E+5 - 4.50E+8 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+5 - 4.50E+8 Ω	ASTM D 257
Volume resistivity	23.0 °C	1.00E+5 - 4.50E+8 Ω·cm Show Supplier Material materials with Volume resistivity of 1.00E+5 - 4.50E+8 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		22.6 g/10min Show Supplier Material materials with Melt mass-flow rate of 22.6 g/10min	ASTM D 1238 \| 300°C/5.0 kgf
Melt volume-flow rate		22 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 22 cm³/10min	ISO 1133 \| MVR at 300°C/5.0 kg
Shrinkage	23.0 °C	0.6 % Show Supplier Material materials with Shrinkage of 0.6 %	SABIC method
Shrinkage, transverse	23.0 °C	0.6 % Show Supplier Material materials with Shrinkage, transverse of 0.6 %	SABIC method

Technological properties

Property
Application areas	Enclosures, Electronic Components, Data Management, Wireless Communications, Semiconductor, Personal Computing
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120°C Drying Time: 4hrs Maximum Moisture Content: 0.02% Melt Temperature: 305 to 325.0°C Front - Zone 3 Temperature: 320 to 330.0°C Middle - Zone 2 Temperature: 310 to 320.0°C Rear - Zone 1 Temperature: 295 to 305.0°C Mold Temperature: 80 to 110.0°C Back Pressure: 0.2 to 0.3MPa Screw Speed: 30 to 60.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.