LNP™ THERMOCOMP™ Compound JF003E

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Description

LNP THERMOCOMP JF003E is a compound based on Polyethersulfone resin containing 15% Glass Fiber. Added features of this material include: Easy Molding.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.48 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.9 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.49 [-]

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ASTM D 792 |

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

5.7 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

2.3 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

5.3 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

174 MPa

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ISO 178

Impact strength, Izod notched

23.0 °C

5 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

43 J/m

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ASTM D 256

Impact strength, Izod unnotched

23.0 °C

33 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

500 J/m

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ASTM D 4812 | 23°C

Instrumented Impact, Total Energy

23.0 °C

7 J

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ASTM D 3763 | 23°C

Tensile strength

23.0 °C

101 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

4.2E-5 1/K

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ASTM D 696 | -30°C to 30°C

Coefficient of thermal expansion, transverse

23.0 °C

4.7E-5 1/K

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ASTM D 696 | -30°C to 30°C

Heat deflection temperature

211 - 218 °C

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Heat deflection temperature, 0.45 MPa

218 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

211 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.4 %

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ASTM D 955 | 24 hrs

Shrinkage, transverse

23.0 °C

0.6 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Electronic Components

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120 to 150.0°C
Drying Time: 4hrs
Maximum Moisture Content: 0.05%
Melt Temperature: 355 to 370.0°C
Front - Zone 3 Temperature: 370 to 380.0°C
Middle - Zone 2 Temperature: 360 to 370.0°C
Rear - Zone 1 Temperature: 345 to 355.0°C
Mold Temperature: 140 to 150.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 60 to 100.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.