LNP™ THERMOCOMP™ Compound GF004 - Americas

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Description

LNP THERMOCOMP GF004 is a compound based on Polysulfone resin containing 20% Glass Fiber.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

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Available suppliers

SABIC

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Applications

Electrical Engineering

Defense

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.4 g/cm³ Show Supplier Material materials with Density of 1.4 g/cm³	ISO 1183

Mechanical

Property	Temperature	Value	Comment
Elongation	23.0 °C	2.3 % Show Supplier Material materials with Elongation of 2.3 %	ASTM D 638 \| yield
Flexural modulus	23.0 °C	6 GPa Show Supplier Material materials with Flexural modulus of 6 GPa	ISO 178
Flexural strength	23.0 °C	153 MPa Show Supplier Material materials with Flexural strength of 153 MPa	ISO 178 \| break, 2 mm/min
Impact strength, Izod notched	23.0 °C	10 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 10 kJ/m²	ISO 180/1A \| 80104, 23°C
Impact strength, Izod unnotched	23.0 °C	31 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 31 kJ/m²	ISO 180/1U \| unnotched 80104
Tensile strength	23.0 °C	91 MPa Show Supplier Material materials with Tensile strength of 91 MPa	ASTM D 638 \| yield

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	2.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2.5E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	5.2E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 5.2E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Heat deflection temperature		180 - 182 °C Show Supplier Material materials with Heat deflection temperature of 180 - 182 °C
Heat deflection temperature, 0.45 MPa		180 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 180 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		182 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 182 °C	ISO 75/Af \| Flatw 80104 sp=64mm

Technological properties

Property
Application areas	Wiring Devices, Weapon
Availability	Europe,Asia,Americas
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.