LNP™ COLORCOMP™ Compound W1000Z

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Description

LNP COLORCOMP W1000I is a compound based on Polybutylene Terephthalate (PBT) resin. Added features include: High viscosity suitable for extrusion.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Healthcare

Medical Equipment

Medical Equipment General

Pharmaceutical Industry

Electrical Engineering

Automotive

Construction

Water Management

Consumer Goods

Domestic Electrical Appliances

General Appliances

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Properties

General

Property	Temperature	Value	Comment
Relative density	23.0 °C	1.31 [-] Show Supplier Material materials with Relative density of 1.31 [-]	ASTM D 792
Specific volume	23.0 °C	0.76 cm³/g Show Supplier Material materials with Specific volume of 0.76 cm³/g	ASTM D 792
Water absorption	23.0 °C	0.08 % Show Supplier Material materials with Water absorption of 0.08 %	ASTM D 570 \| (23°C/24hrs)

Mechanical

Property	Temperature	Value	Comment
Elongation	23.0 °C	300 % Show Supplier Material materials with Elongation of 300 %	ASTM D 638 \| brk, Type I, 50 mm/min
Flexural modulus	23.0 °C	2.3 GPa Show Supplier Material materials with Flexural modulus of 2.3 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Flexural strength	23.0 °C	82 MPa Show Supplier Material materials with Flexural strength of 82 MPa	ASTM D 790 \| yld, 1.3 mm/min, 50 mm span
Gardner Impact	23.0 °C	40 J Show Supplier Material materials with Gardner Impact of 40 J	ASTM D 3029 \| modified, 23°C
Hardness, Rockwell R	23.0 °C	117 [-] Show Supplier Material materials with Hardness, Rockwell R of 117 [-]	ASTM D 785
Impact strength, Izod notched	23.0 °C	53 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 53 kJ/m²	ASTM D 256 \| notched, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	53 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 53 J/m	ASTM D 256
Impact strength, Izod unnotched, ASTM	23.0 °C	1602 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 1602 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	51 MPa Show Supplier Material materials with Tensile strength of 51 MPa	ASTM D 638 \| yld, Type I, 50 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	8.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 8.1E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		54 - 154 °C Show Supplier Material materials with Heat deflection temperature of 54 - 154 °C
Heat deflection temperature, 0.45 MPa		154 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 154 °C	ASTM D 648 \| 6.4 mm, unannealed
Heat deflection temperature, 1.80 MPa		54 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 54 °C	ASTM D 648 \| 6.4 mm, unannealed

Electrical

Property	Temperature	Value	Comment
Volume resistivity	23.0 °C	4.00E+16 Ω·cm Show Supplier Material materials with Volume resistivity of 4.00E+16 Ω·cm	>, ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Melt volume-flow rate		9 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 9 cm³/10min	ISO 1133 \| MVR at 250°C/2.16 kg
Shrinkage	23.0 °C	1.5 % Show Supplier Material materials with Shrinkage of 1.5 %	SABIC method \| 2.3-4.6 mm
Shrinkage, transverse	23.0 °C	1.6 % Show Supplier Material materials with Shrinkage, transverse of 1.6 %	SABIC method \| 2.3-4.6 mm

Technological properties

Property
Application areas	Water Treatment/Filtration, Wiring Devices, Vending Machine, Personal Care, Medical Device, Pharmaceutical Packaging & Drug Delivery, Servingware, Electronic Components, Food Processor, Heavy Vehicles, Lab Ware and Clinical Diagnostics, Air Filtration, Commercial Storage/Cookware, Wire & cable
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 110 to 120.0°C Drying Time: 4 to 6.0hrs Drying Time (Cumulative): 8hrs Maximum Moisture Content: 0.02% Melt Temperature: 245 to 260.0°C Barrel - Zone 1 Temperature: 200 to 230.0°C Barrel - Zone 2 Temperature: 240 to 255.0°C Barrel - Zone 3 Temperature: 240 to 275.0°C Barrel - Zone 4 Temperature: 240 to 275.0°C Adapter Temperature: 240 to 275.0°C Die Temperature: 240 to 275.0°C Waterbath Temperature: 25 to 35.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.