LNP™ THERMOTUF™ Compound WF004N

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Description

LNP THERMOTUF WF004N (experimental grade name as ER007485) is a PBT based compound containing 20% glass for Nano-Molding Technology (NMT) application. Added features of this material include: low dielectric constant (Dk), good metal bonding strength, and good chemical resistance.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Applications

Electronics

Display Devices

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.28 g/cm³ Show Supplier Material materials with Density of 1.28 g/cm³	ISO 1183

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	5.7 GPa Show Supplier Material materials with Elastic modulus of 5.7 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	3.3 % Show Supplier Material materials with Elongation of 3.3 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	5.1 GPa Show Supplier Material materials with Flexural modulus of 5.1 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	139 MPa Show Supplier Material materials with Flexural strength of 139 MPa	ISO 178 \| break, 2 mm/min
Impact strength, Izod notched	23.0 °C	12 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 12 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	120 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 120 J/m	ASTM D 256
Impact strength, Izod unnotched	23.0 °C	47 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 47 kJ/m²	ISO 180/1U \| 80104, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	795 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 795 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	88 MPa Show Supplier Material materials with Tensile strength of 88 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	3.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 3.5E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	8.7E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 8.7E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Heat deflection temperature		194 - 219 °C Show Supplier Material materials with Heat deflection temperature of 194 - 219 °C
Heat deflection temperature, 0.45 MPa		219 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 219 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		194 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 194 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Relative temperature index, electrical		75 °C Show Supplier Material materials with Relative temperature index, electrical of 75 °C	UL 746B
Relative temperature index, mechanical impact		75 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 75 °C	UL 746B
Relative temperature index, mechanical strength		75 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 75 °C	UL 746B
Flammability	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103831978- - <br> UL Recognized, 94HB Flame Class Rating: ≥1mm UL 94

Electrical

Property	Temperature	Value	Comment
Dielectric constant	23.0 °C	2.93 [-] Show Supplier Material materials with Dielectric constant of 2.93 [-]	SABIC method \| 1.9 GHz
Dielectric constant, 10GHz	23.0 °C	2.97 [-] Show Supplier Material materials with Dielectric constant, 10GHz of 2.97 [-]	SABIC method
Dielectric constant, 1GHz	23.0 °C	2.95 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 2.95 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	2.96 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 2.96 [-]	SABIC method
Dissipation factor	23.0 °C	9E-3 [-] Show Supplier Material materials with Dissipation factor of 9E-3 [-]	SABIC method
Dissipation factor, 1GHz	23.0 °C	9.2E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 9.2E-3 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	7.9E-3 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 7.9E-3 [-]	SABIC method

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		20 g/10min Show Supplier Material materials with Melt mass-flow rate of 20 g/10min	ASTM D 1238 \| 275°C/5 kgf
Melt volume-flow rate		18 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 18 cm³/10min	ISO 1133 \| MVR at 275°C/5 kg
Shrinkage	23.0 °C	0.55 % Show Supplier Material materials with Shrinkage of 0.55 %	SABIC method
Shrinkage, transverse	23.0 °C	1.05 % Show Supplier Material materials with Shrinkage, transverse of 1.05 %	SABIC method

Technological properties

Property
Application areas	Auto Electrical, Personal Computing, Wireless Communications
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 100 to 120.0°C Drying Time: 2 to 4.0hrs Maximum Moisture Content: 0.02% Melt Temperature: 265 to 280.0°C Nozzle Temperature: 265 to 280.0°C Front - Zone 3 Temperature: 265 to 280.0°C Middle - Zone 2 Temperature: 260 to 280.0°C Rear - Zone 1 Temperature: 250 to 270.0°C Mold Temperature: 100 to 160.0°C
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