LEXAN™ FR Resin LGK5030

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Description

LEXAN LGK5030 is a compound based on Polycarbonate resin containing 50% glass contents. Added features of this material include: Flame Retardant.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValueComment

Relative density

23.0 °C

1.61 [-]

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ASTM D 792 |

Water absorption

23.0 °C

0.14 %

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ASTM D 570 | (23°C/24hrs)

Mechanical

PropertyTemperatureValueComment

Elongation

23.0 °C

4 %

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ASTM D 638 | brk, Type I, 50 mm/min

Flexural modulus

23.0 °C

10.7 GPa

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ASTM D 790 | 1.3 mm/min, 50 mm span

Flexural strength

23.0 °C

186 MPa

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ASTM D 790 | brk, 1.3 mm/min, 50 mm span

Impact strength, Izod notched

23.0 °C

122 kJ/m²

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ASTM D 256 | notched, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

122 J/m

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ASTM D 256 | notched, 23°C

Tensile strength

23.0 °C

142 MPa

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ASTM D 638 | brk, Type I, 50 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

2.16E-5 1/K

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ASTM D 696 | -30°C to 30°C

Coefficient of thermal expansion, transverse

23.0 °C

3.96E-5 1/K

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ASTM D 696 | -30°C to 30°C

Heat deflection temperature

143 °C

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Heat deflection temperature, 1.80 MPa

143 °C

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ASTM D 648 | 6.4 mm, unannealed

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Flammability

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=228441- - <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=236912- - <br> UL Recognized, 94-5VA Flame Class Rating: ≥2.8mm UL 94 <br> UL Recognized, 94V-0 Flame Class Rating: ≥2.8mm UL 94 <br> UL Recognized, 94V-1 Flame Class Rating: ≥1.5mm UL 94

Electrical

PropertyTemperatureValueComment

Dielectric strength

23.0 °C

16.3 kV/mm

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ASTM D 149 | in oil, 3.2 mm

High Amp Arc Ignition

23.0 °C

2.8 mm

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UL 746A | PLC 4

Hot-Wire Ignition

23.0 °C

2.8 mm

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UL 746A | PLC 1

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.05 %

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SABIC method | 3.2 mm

Shrinkage, transverse

23.0 °C

0.1 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Document Handling

Availability

Europe,Asia,MEA,Americas,Global

Processing methods

Drying Temperature: 120°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 48hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 315 to 340.0°C
Nozzle Temperature: 310 to 330.0°C
Front - Zone 3 Temperature: 315 to 340.0°C
Middle - Zone 2 Temperature: 305 to 325.0°C
Rear - Zone 1 Temperature: 295 to 315.0°C
Mold Temperature: 80 to 115.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.