General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.35 g/cm³ Show Supplier Material materials with Density of 1.35 g/cm³ | ASTM D 792 |
Water absorption | 23.0 °C | 0.07 % Show Supplier Material materials with Water absorption of 0.07 % | ISO 62-1 | (23°C/saturated) |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 6.8 GPa Show Supplier Material materials with Elastic modulus of 6.8 GPa | ISO 527 | 1 mm/min |
Elongation | 23.0 °C | 2.6 % Show Supplier Material materials with Elongation of 2.6 % | ISO 527 | break, 5 mm/min |
Flexural modulus | 23.0 °C | 6.3 GPa Show Supplier Material materials with Flexural modulus of 6.3 GPa | ISO 178 | 2 mm/min |
Flexural strength | 23.0 °C | 166 MPa Show Supplier Material materials with Flexural strength of 166 MPa | ISO 178 | break, 2 mm/min |
Impact strength, Charpy notched | 23.0 °C | 14 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 14 kJ/m² | ISO 179/1eA | V-notch Edgew, 23°C, 80*10*4 sp=62mm |
Impact strength, Izod notched | 23.0 °C | 147 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 147 kJ/m² | ASTM D 256 | notched, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 147 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 147 J/m | ASTM D 256 |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 650 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 650 J/m | ASTM D 4812 | 23°C |
Instrumented Impact, at Peak | 23.0 °C | 20 J Show Supplier Material materials with Instrumented Impact, at Peak of 20 J | ASTM D 3763 | 23°C |
Tensile strength | 23.0 °C | 112 MPa Show Supplier Material materials with Tensile strength of 112 MPa | ISO 527 | break, 5 mm/min |
Thermal
Property | Temperature | Value | Comment | ||
---|---|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 2.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2.5E-5 1/K | ISO 11359-2 | 23°C to 80°C | ||
Coefficient of thermal expansion, transverse | 23.0 °C | 7.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7.5E-5 1/K | ISO 11359-2 | 23°C to 80°C | ||
Heat deflection temperature | 115 - 121 °C Show Supplier Material materials with Heat deflection temperature of 115 - 121 °C | ||||
Heat deflection temperature, 0.45 MPa | 121 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 121 °C | ASTM D 648 | 3.2 mm, unannealed | |||
Heat deflection temperature, 1.80 MPa | 115 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 115 °C | ASTM D 648 | 3.2mm, unannealed | |||
Relative temperature index, electrical | 80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C | UL 746B | |||
Relative temperature index, mechanical impact | 80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C | UL 746B | |||
Relative temperature index, mechanical strength | 80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C | UL 746B | |||
Flammability | UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=104088917- - <br> UL Yellow Card Link 2: https://iq.ul.com/ul/cert.aspx?ULID=104123741- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.3mm UL 94 <br> UL Recognized, 94-5VA Flame Class Rating: ≥1.5mm UL 94 <br> UV-light, water exposure/immersion: F1- UL 746C |
Electrical
Property | Temperature | Value | Comment |
---|---|---|---|
Comparative tracking index | 23.0 °C | 175 V Show Supplier Material materials with Comparative tracking index of 175 V | IEC 60112 | |
Dielectric constant | 23.0 °C | 3.27 [-] Show Supplier Material materials with Dielectric constant of 3.27 [-] | SABIC method | 1.9 GHz |
Dielectric constant, 10GHz | 23.0 °C | 3.28 [-] Show Supplier Material materials with Dielectric constant, 10GHz of 3.28 [-] | SABIC method |
Dielectric constant, 1GHz | 23.0 °C | 3.24 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.24 [-] | SABIC method | 1.1 GHz |
Dielectric constant, 5GHz | 23.0 °C | 3.28 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.28 [-] | SABIC method |
Dissipation factor | 23.0 °C | 6.7E-3 [-] Show Supplier Material materials with Dissipation factor of 6.7E-3 [-] | SABIC method |
Dissipation factor, 1GHz | 23.0 °C | 6.6E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 6.6E-3 [-] | SABIC method | |
Dissipation factor, 5GHz | 23.0 °C | 7.1E-3 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 7.1E-3 [-] | SABIC method |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Melt mass-flow rate | 12 g/10min Show Supplier Material materials with Melt mass-flow rate of 12 g/10min | ASTM D 1238 | 300°C/1.2 kgf | |
Melt volume-flow rate | 20 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 20 cm³/10min | ISO 1133 | MVR at 300°C/2.16 kg | |
Shrinkage | 23.0 °C | 0.2 % Show Supplier Material materials with Shrinkage of 0.2 % | ASTM D 955 | 24 hrs |
Shrinkage, transverse | 23.0 °C | 0.2 % Show Supplier Material materials with Shrinkage, transverse of 0.2 % | ASTM D 955 | 24 hrs |
Technological properties
Property | ||
---|---|---|
Application areas | Data Transfer, Audio, Watch/Jewelry, Wireless Communications, Personal Computing | |
Availability | Europe,Asia,Americas | |
Processing methods | Drying Temperature: 110°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |