LNP™ THERMOCOMP™ Compound DF0061VI

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Description

LNP Thermocomp DF0061VI compound is a 30% glass fiber reinforced PC resin based LDS material solution with fast plating and stable RF performance. It is non chlorinated/brominated flame retardant. Wide processing window makes it a good candidate for internal and external parts for Laser Direct Structuring applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Applications

Electrical Engineering

Electronics

Display Devices

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.5 g/cm³ Show Supplier Material materials with Density of 1.5 g/cm³	ASTM D 792

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	9.3 GPa Show Supplier Material materials with Elastic modulus of 9.3 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	2 % Show Supplier Material materials with Elongation of 2 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	8.2 GPa Show Supplier Material materials with Flexural modulus of 8.2 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	150 MPa Show Supplier Material materials with Flexural strength of 150 MPa	ISO 178 \| 2 mm/min
Impact strength, Charpy notched	23.0 °C	7 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 7 kJ/m²	ISO 179/1eA \| V-notch Edgew, 23°C, 80104 sp=62mm
Impact strength, Izod notched	23.0 °C	7 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 7 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	70 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 70 J/m	ASTM D 256
Impact strength, Izod unnotched	23.0 °C	30 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 30 kJ/m²	ISO 180/1U \| unnotched 80104
Impact strength, Izod unnotched, ASTM	23.0 °C	400 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 400 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	106 MPa Show Supplier Material materials with Tensile strength of 106 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	2.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	6.2E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 6.2E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Heat deflection temperature		115 - 118 °C Show Supplier Material materials with Heat deflection temperature of 115 - 118 °C
Heat deflection temperature, 0.45 MPa		118 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 118 °C	ASTM D 648 \| 3.2 mm, unannealed
Heat deflection temperature, 1.80 MPa		115 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 115 °C	ASTM D 648 \| 3.2mm, unannealed

Electrical

Property	Temperature	Value	Comment
Dielectric constant	23.0 °C	3.3 [-] Show Supplier Material materials with Dielectric constant of 3.3 [-]	SABIC method \| 20 GHz
Dielectric constant, 10GHz	23.0 °C	3.52 [-] Show Supplier Material materials with Dielectric constant, 10GHz of 3.52 [-]	SABIC method
Dielectric constant, 1GHz	23.0 °C	3.59 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.59 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	3.52 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.52 [-]	SABIC method
Dissipation factor	23.0 °C	8E-3 [-] Show Supplier Material materials with Dissipation factor of 8E-3 [-]	SABIC method \| 20 GHz
Dissipation factor, 1GHz	23.0 °C	9E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 9E-3 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	8E-3 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 8E-3 [-]	SABIC method

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		13 g/10min Show Supplier Material materials with Melt mass-flow rate of 13 g/10min	ASTM D 1238 \| 300°C/1.2 kgf
Shrinkage	23.0 °C	0.1 % Show Supplier Material materials with Shrinkage of 0.1 %	SABIC method
Shrinkage, transverse	23.0 °C	0.1 % Show Supplier Material materials with Shrinkage, transverse of 0.1 %	SABIC method

Technological properties

Property
Application areas	Electronic Components, Personal Computing, Wearables, Wireless Communications
Availability	Europe,Asia,Americas
Processing methods	Drying Time: 3 to 4.0hrs Melt Temperature: 290 to 310.0°C Nozzle Temperature: 285 to 310.0°C Front - Zone 3 Temperature: 285 to 310.0°C Middle - Zone 2 Temperature: 285 to 310.0°C Rear - Zone 1 Temperature: 285 to 310.0°C Mold Temperature: 100 to 130.0°C Back Pressure: 0.1 to 0.3MPa Screw Speed: 50 to 150.0rpm Drying Temperature: 110 to 120.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.