LNP™ THERMOTUF™ Compound WF009N

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Description

LNP THERMOTUF WF009N is a PBT based compound containing 45% glass fiber for nano-molding technology (NMT) application especially at low molding temperature. Added features include high metal bonding strength.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.7 g/cm³

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

14.1 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

2.1 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

12.3 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

259 MPa

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ISO 178 | break, 2 mm/min

Impact strength, Charpy notched

23.0 °C

17 kJ/m²

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ISO 179/2C | 23°C

Impact strength, Charpy unnotched

23.0 °C

72 kJ/m²

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ISO 179/2C | 23°C

Impact strength, Izod notched

23.0 °C

16 kJ/m²

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ISO 180/1A | notched 80*10*4, -30°C

Impact strength, Izod notched, ASTM

23.0 °C

144 J/m

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ASTM D 256 | notched, -30°C

Impact strength, Izod unnotched

23.0 °C

64 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

1050 J/m

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ASTM D 4812 | 23°C

Tensile strength

23.0 °C

163 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.5E-5 1/K

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ASTM E 831 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

5.6E-5 1/K

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ASTM E 831 | -40°C to 40°C

Heat deflection temperature

211 °C

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Heat deflection temperature, 1.80 MPa

211 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

75 °C

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UL 746B

Relative temperature index, mechanical impact

75 °C

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UL 746B

Relative temperature index, mechanical strength

75 °C

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UL 746B

Vicat softening temperature

213 °C

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ISO 306 | Rate A/50

Flammability

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=103351811- - <br> UL Recognized, 94HB Flame Class Rating: ≥0.7mm UL 94

Electrical

PropertyTemperatureValueComment

Dielectric constant

23.0 °C

3.95 [-]

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SABIC method | 1.9 GHz

Dielectric constant, 1GHz

23.0 °C

3.94 [-]

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SABIC method | 1.1 GHz

Dissipation factor

23.0 °C

0.01 [-]

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SABIC method

Dissipation factor, 1GHz

23.0 °C

0.01 [-]

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SABIC method |

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

29 cm³/10min

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ISO 1133 | MVR at 275°C/5 kg

Shrinkage

23.0 °C

0.14 %

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SABIC method

Shrinkage, transverse

23.0 °C

0.34 %

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SABIC method

Technological properties

Property
Application areas

Electrical Components & Infrastructure

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 100 to 120.0°C
Drying Time: 4 to 8.0hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 265 to 285.0°C
Nozzle Temperature: 265 to 285.0°C
Front - Zone 3 Temperature: 265 to 285.0°C
Middle - Zone 2 Temperature: 260 to 280.0°C
Rear - Zone 1 Temperature: 250 to 270.0°C
Mold Temperature: 100 to 140.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.