LNP™ THERMOCOMP™ Compound LF006EX1

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Description

LNP THERMOCOMP LF006EX1 is a compound based on Polyetheretherketone resin containing 30% Glass Fiber. Added features of this material include: low warpage, easy Molding.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.532 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

0.09 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.54 [-]

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

11.8 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

1.9 %

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ISO 527 | break

Flexural modulus

23.0 °C

10.2 GPa

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ISO 178

Flexural strength

23.0 °C

225 MPa

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ISO 178

Impact strength, Charpy notched

23.0 °C

10 kJ/m²

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ISO 179/1eA | V-notch Edgew 80*10*3 sp=62mm, 23°C

Impact strength, Izod notched

23.0 °C

10 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

95 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched

23.0 °C

47.1 kJ/m²

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ISO 180/1U | 80*10*4, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

732 J/m

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ASTM D 4812 | 23°C

Tensile strength

23.0 °C

164 MPa

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ISO 527 | break

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

2.23E-5 1/K

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ASTM E 831 | -40°C to 120°C

Coefficient of thermal expansion, transverse

23.0 °C

4.1E-5 1/K

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ASTM E 831 | -40°C to 120°C

Electrical

PropertyTemperatureValueComment

Dielectric constant

23.0 °C

3.84 [-]

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SABIC method | 1.9 GHz

Dielectric constant, 1GHz

23.0 °C

3.82 [-]

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SABIC method | 1.1 GHz

Dissipation factor

23.0 °C

4.1E-3 [-]

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SABIC method

Dissipation factor, 1GHz

23.0 °C

3.9E-3 [-]

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SABIC method |

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.43 %

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ASTM D 955 | 24 hrs

Shrinkage, transverse

23.0 °C

0.65 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Oil/Gas, Air Cabin Interiors, Heavy Vehicles, Enclosures, Electronic Components

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 150°C
Drying Time: 4 to 6.0hrs
Front - Zone 3 Temperature: 380 to 400.0°C
Middle - Zone 2 Temperature: 380 to 400.0°C
Rear - Zone 1 Temperature: 370 to 380.0°C
Mold Temperature: 175 to 190.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 60 to 100.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.