LNP™ THERMOCOMP™ Compound DX13354X

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Description

LNP Thermocomp compound DX13354X is a colorable, glass fiber reinforced Polycarbonate resin based LDS material solution with stable plating and RF performance, providing excellent stiffness with good surface and good impact strength. The product is available for internal and external parts for Laser Direct Structuring applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Applications

Electrical Engineering

Electronics

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.43 g/cm³ Show Supplier Material materials with Density of 1.43 g/cm³	ISO 1183
Relative density	23.0 °C	1.43 [-] Show Supplier Material materials with Relative density of 1.43 [-]	ASTM D 792

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	6.6 GPa Show Supplier Material materials with Elastic modulus of 6.6 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	2.1 % Show Supplier Material materials with Elongation of 2.1 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	6.4 GPa Show Supplier Material materials with Flexural modulus of 6.4 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	130 MPa Show Supplier Material materials with Flexural strength of 130 MPa	ISO 178 \| 2 mm/min
Impact strength, Charpy notched	23.0 °C	9 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 9 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Charpy unnotched	23.0 °C	36 kJ/m² Show Supplier Material materials with Impact strength, Charpy unnotched of 36 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Izod notched	23.0 °C	9 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 9 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	90 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 90 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched	23.0 °C	32 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 32 kJ/m²	ISO 180/1U \| 80104, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	500 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 500 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	90 MPa Show Supplier Material materials with Tensile strength of 90 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	1.9E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.9E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	6.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 6.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Heat deflection temperature		122 - 126 °C Show Supplier Material materials with Heat deflection temperature of 122 - 126 °C
Heat deflection temperature, 0.45 MPa		126 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 126 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		122 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 122 °C	ISO 75/Af \| Flatw 80104 sp=64mm

Electrical

Property	Temperature	Value	Comment
Dielectric constant	23.0 °C	3.45 [-] Show Supplier Material materials with Dielectric constant of 3.45 [-]	SABIC method \| 1.9 GHz
Dielectric constant, 1GHz	23.0 °C	3.47 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.47 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	3.45 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.45 [-]	SABIC method
Dissipation factor	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor of 0.01 [-]	SABIC method
Dissipation factor, 1GHz	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 0.01 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 0.01 [-]	SABIC method

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		12 g/10min Show Supplier Material materials with Melt mass-flow rate of 12 g/10min	ASTM D 1238 \| 280°C/2.16 kgf
Melt volume-flow rate		13 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 13 cm³/10min	ASTM D 1238 \| MVR at 300°C/1.2 kg
Shrinkage	23.0 °C	0.1 % Show Supplier Material materials with Shrinkage of 0.1 %	SABIC method \| 3.2 mm
Shrinkage, transverse	23.0 °C	0.3 % Show Supplier Material materials with Shrinkage, transverse of 0.3 %	SABIC method \| 3.2 mm

Technological properties

Property
Application areas	Enclosures, Wireless Communications
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 110°C Drying Time: 3 to 4.0hrs Melt Temperature: 270 to 295.0°C Nozzle Temperature: 270 to 295.0°C Front - Zone 3 Temperature: 270 to 295.0°C Middle - Zone 2 Temperature: 270 to 295.0°C Rear - Zone 1 Temperature: 270 to 295.0°C Mold Temperature: 100 to 120.0°C
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