LNP™ STAT-KON™ Compound DD000XI

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Description

LNP STAT-KON DD000XI is a compound based on Polycarbonate co-polymer resin containing carbon powder Added features of this grade include: electrically conductive, improved impact properties, hydrolytic stability and complying with latest ATEX regulations

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.21 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.06 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.21 [-]

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.5 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

5 %

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ISO 527 | yield, 50 mm/min

Flexural modulus

23.0 °C

2.3 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

90 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Charpy notched

23.0 °C

10 kJ/m²

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ISO 179/1eA | V-notch Edgew, 23°C, 80*10*4 sp=62mm

Impact strength, Izod notched

23.0 °C

10 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

230 J/m

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ASTM D 256

Multi-Axial Instrumented Impact Energy

23.0 °C

62 J

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ISO 6603-2 | 23°C

Tensile strength

23.0 °C

45 MPa

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ISO 527 | break, 50 mm/min

Impact strength, Izod unnotched

ISO 180/1U | 80*10*4, 23°C

Impact strength, Izod unnotched, ASTM

ASTM D 4812 | 23°C

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

6.3E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

6.2E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Heat deflection temperature

129 - 139 °C

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Heat deflection temperature, 0.45 MPa

139 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

129 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Vicat softening temperature

145 °C

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ISO 306 | Rate B/50

Electrical

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+6 - 1.00E+10 Ω

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

5 cm³/10min

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ISO 1133 | MVR at 300°C/2.16 kg

Shrinkage

23.0 °C

0.6 %

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SABIC method

Shrinkage, transverse

23.0 °C

0.6 %

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SABIC method

Technological properties

Property
Application areas

Cable junction box, Valve control housing, Sensor housing

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 48hrs
Maximum Moisture Content: 0.02%
Hopper Temperature: 40 to 60.0°C
Melt Temperature: 295 to 335.0°C
Rear - Zone 1 Temperature: 275 to 315.0°C
Middle - Zone 2 Temperature: 285 to 325.0°C
Front - Zone 3 Temperature: 295 to 335.0°C
Nozzle Temperature: 290 to 330.0°C
Mold Temperature: 70 to 95.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: normalrpm
Shot to Cylinder Size: 30 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.