General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.425 g/cm³ Show Supplier Material materials with Density of 1.425 g/cm³ | ASTM D 792 |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 9.4 GPa Show Supplier Material materials with Elastic modulus of 9.4 GPa | ASTM D 638 | 5 mm/min |
Elongation | 23.0 °C | 2.2 % Show Supplier Material materials with Elongation of 2.2 % | ASTM D 638 | brk, Type I, 5 mm/min |
Flexural modulus | 23.0 °C | 8.4 GPa Show Supplier Material materials with Flexural modulus of 8.4 GPa | ASTM D 790 | 1.3 mm/min, 50 mm span |
Flexural strength | 23.0 °C | 180 MPa Show Supplier Material materials with Flexural strength of 180 MPa | ASTM D 790 | brk, 1.3 mm/min, 50 mm span |
Impact strength, Izod notched | 23.0 °C | 128 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 128 kJ/m² | ASTM D 256 | notched, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 128 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 128 J/m | ASTM D 256 | notched, 23°C |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 537 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 537 J/m | ASTM D 4812 | 23°C |
Tensile strength | 23.0 °C | 129 MPa Show Supplier Material materials with Tensile strength of 129 MPa | ASTM D 638 | brk, Type I, 5 mm/min |
Thermal
Property | Temperature | Value | Comment | ||
---|---|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.9E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 1.9E-5 1/K | ASTM E 831 | -40°C to 40°C | ||
Coefficient of thermal expansion, transverse | 23.0 °C | 6.9E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 6.9E-5 1/K | ASTM E 831 | -40°C to 40°C | ||
Heat deflection temperature | 119 °C Show Supplier Material materials with Heat deflection temperature of 119 °C | ||||
Heat deflection temperature, 1.80 MPa | 119 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 119 °C | ASTM D 648 | 3.2mm, unannealed | |||
Relative temperature index, electrical | 80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C | UL 746B | |||
Relative temperature index, mechanical impact | 80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C | UL 746B | |||
Relative temperature index, mechanical strength | 80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C | UL 746B | |||
Flammability | UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102832656- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.8mm UL 94 |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Melt mass-flow rate | 27.3 g/10min Show Supplier Material materials with Melt mass-flow rate of 27.3 g/10min | ASTM D 1238 | 300°C/2.16 kgf | |
Shrinkage | 23.0 °C | 0.1 % Show Supplier Material materials with Shrinkage of 0.1 % | ASTM D 955 | 24 hrs |
Shrinkage, transverse | 23.0 °C | 0.1 % Show Supplier Material materials with Shrinkage, transverse of 0.1 % | ASTM D 955 | 24 hrs |
Technological properties
Property | ||
---|---|---|
Application areas | Wireless Communications, Personal Computing, Data Transfer, Electronic Components | |
Availability | Europe,Asia,Americas | |
Processing methods | Drying Temperature: 110°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |