PPE reactive chemistries SA9000

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Description

NORYL SA9000 resin is a modified, low molecular weight, bi-functional oligomer based on polyphenylene ether (PPE) with vinyl end-groups. It is well suited for use with other unsaturated monomers and resins which cure via free radical reactions. These include styrenic, allylic, acrylic, maleimide, methacrylic, and unsaturated polyesters monomers and resins. It has a low solution viscosity and outstanding solubility in toluene & methyl ethyl ketone (MEK). Key application areas are in electronic packaging which include PCB laminates, copper clad laminates, non-epoxy prepregs, and adhesives. The use of NORYL SA9000 is especially advantageous in insulating materials where very low dielectric properties and decreased moisture absorption are required.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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SABIC

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Applications

Manufacturing

Additive Manufacturing

Electronics

Display Devices

Composite Industry

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Properties

General

Property	Temperature	Value	Comment
Relative density	23.0 °C	1.02 [-] Show Supplier Material materials with Relative density of 1.02 [-]	ASTM D 792

Thermal

Property	Value	Comment
Glass transition temperature	160 °C Show Supplier Material materials with Glass transition temperature of 160 °C	SABIC method \| (half width)

Electrical

Property	Temperature	Value	Comment
Dielectric constant, 1MHz	23.0 °C	2.54 [-] Show Supplier Material materials with Dielectric constant, 1MHz of 2.54 [-]	ASTM D 150
Dissipation factor, 1MHz	23.0 °C	7E-4 [-] Show Supplier Material materials with Dissipation factor, 1MHz of 7E-4 [-]	ASTM D 150 \|

Rheological Properties

Property	Temperature	Value	Comment
Viscosity	23.0 °C	0.16 Pa·s Show Supplier Material materials with Viscosity of 0.16 Pa·s	SABIC method \| 50 wt% in methyl ethyl ketone, 25°C

Technological properties

Property
Application areas	Electronic Material, Electronic Material Handling, Additive Plastic, Composite, Circuit Board, Data Transfer
Availability	Europe,Asia,Americas
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.