General
Property | Temperature | Value | Comment |
---|---|---|---|
Bulk density | 23.0 °C | 1E-3 g/cm³ Show Supplier Material materials with Bulk density of 1E-3 g/cm³ | ISO 1183 |
Thermal
Property | Value | Comment |
---|---|---|
Glass transition temperature | 165 °C Show Supplier Material materials with Glass transition temperature of 165 °C | SABIC method | (half width) |
Electrical
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Viscosity | 23.0 °C | 73.4 Pa·s Show Supplier Material materials with Viscosity of 73.4 Pa·s | SABIC method | pure, 240°C |
Technological properties
Property | ||
---|---|---|
Application areas | Electronic Components, Additive Plastic, Additive Semiconductor Materials, Circuit Board, Composite, Wire & cable | |
Availability | Europe,Asia,Americas | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |