LNP™ STAT-KON™ Compound DX13315C

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Description

LNPTM Stat-KonTM DX13315C is an electrical conductive thermoplastic compound featuring electrostatic discharge (ESD) safe performance based on a unique Ultra Clean Polycarbonate (PC) resin reinforced with 15% carbon fiber. This compound provides good stiffness, dimension stability and has extremely high level of cleanliness for the most demanding applications in the Hard Disk Drive and Semiconductor industry. A unique feature of this material is its low C18-C40 hydrocarbons and this compound is manufactured using the LNP Clean Compounding Solution (CCS) technology.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValueComment

Relative density

23.0 °C

1.26 [-]

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ASTM D 792 |

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

10.6 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

2.6 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

9.3 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

203 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Charpy notched

23.0 °C

9 kJ/m²

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ISO 179/2C | 23°C

Impact strength, Charpy unnotched

23.0 °C

45 kJ/m²

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ISO 179/2C | 23°C

Impact strength, Izod notched

23.0 °C

88 kJ/m²

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ASTM D 256 | notched, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

88 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

591 J/m

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ASTM D 4812 | 23°C

Tensile strength

23.0 °C

130 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.4E-5 1/K

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ASTM E 831 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

8.1E-5 1/K

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ASTM E 831 | -40°C to 40°C

Heat deflection temperature

123 °C

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Heat deflection temperature, 1.80 MPa

123 °C

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ASTM D 648 | 3.2mm, unannealed

Flammability

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102010749- - <br> UL Recognized, 94HB Flame Class Rating: 1mm UL 94

Electrical

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

5000 - 500000 Ω

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ASTM D 257

Volume resistivity

23.0 °C

5.00E+4 - 5.00E+6 Ω·cm

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

30 cm³/10min

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ISO 1133 | MVR at 300°C/5.0 kg

Shrinkage

23.0 °C

0.1 %

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SABIC method | 3.2 mm

Shrinkage, transverse

23.0 °C

0.2 %

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SABIC method | 3.2 mm

Technological properties

Property
Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 90 to 110.0°C
Drying Time: 3 to 5.0hrs
Melt Temperature: 280 to 320.0°C
Nozzle Temperature: 280 to 320.0°C
Front - Zone 3 Temperature: 280 to 320.0°C
Middle - Zone 2 Temperature: 280 to 320.0°C
Rear - Zone 1 Temperature: 250 to 280.0°C
Mold Temperature: 90 to 120.0°C
Back Pressure: 1 to 5.0MPa
Screw Speed: 30 to 100.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.