LNP™ STAT-KON™ Compound DX13320C

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Description

LNPTM Stat-KonTM DX13320C is an electrical conductive thermoplastic compound featuring electrostatic discharge (ESD) safe performance based on a unique Ultra Clean Polycarbonate (PC) resin reinforced with 20% carbon fiber. This compound provides good stiffness, dimension stability and has extremely high level of cleanliness for the most demanding applications in the Hard Disk Drive and Semiconductor industry. A unique feature of this material is its low C18-C40 hydrocarbons and this compound is manufactured using the LNP Clean Compounding Solution (CCS) technology.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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SABIC

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Applications

Electronics

Display Devices

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Properties

General

Property	Temperature	Value	Comment
Relative density	23.0 °C	1.26 [-] Show Supplier Material materials with Relative density of 1.26 [-]	ASTM D 792 \|

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	14.6 GPa Show Supplier Material materials with Elastic modulus of 14.6 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	1.9 % Show Supplier Material materials with Elongation of 1.9 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	11.6 GPa Show Supplier Material materials with Flexural modulus of 11.6 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	187 MPa Show Supplier Material materials with Flexural strength of 187 MPa	ISO 178 \| yield, 2 mm/min
Impact strength, Charpy notched	23.0 °C	7 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 7 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Charpy unnotched	23.0 °C	28 kJ/m² Show Supplier Material materials with Impact strength, Charpy unnotched of 28 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Izod notched	23.0 °C	70 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 70 kJ/m²	ASTM D 256 \| notched, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	70 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 70 J/m	ASTM D 256
Impact strength, Izod unnotched, ASTM	23.0 °C	410 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 410 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	150 MPa Show Supplier Material materials with Tensile strength of 150 MPa	ISO 527 \| break, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	9.2E-6 1/K Show Supplier Material materials with Coefficient of thermal expansion of 9.2E-6 1/K	ASTM E 831 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	7.97E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7.97E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		117 °C Show Supplier Material materials with Heat deflection temperature of 117 °C
Heat deflection temperature, 1.80 MPa		117 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 117 °C	ASTM D 648 \| 3.2mm, unannealed
Relative temperature index, electrical		80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C	UL 746B
Relative temperature index, mechanical impact		80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C	UL 746B
Relative temperature index, mechanical strength		80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C	UL 746B
Flammability	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101977560- - <br> UL Recognized, 94HB Flame Class Rating: ≥1mm UL 94

Electrical

Property	Temperature	Value	Comment
Sheet resistivity, ROA	23.0 °C	5000 - 500000 Ω Show Supplier Material materials with Sheet resistivity, ROA of 5000 - 500000 Ω	ASTM D 257
Volume resistivity	23.0 °C	5000 - 500000 Ω·cm Show Supplier Material materials with Volume resistivity of 5000 - 500000 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Melt volume-flow rate		34 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 34 cm³/10min	ISO 1133 \| MVR at 300°C/5.0 kg
Shrinkage	23.0 °C	0.1 % Show Supplier Material materials with Shrinkage of 0.1 %	SABIC method \| 3.2 mm
Shrinkage, transverse	23.0 °C	0.2 % Show Supplier Material materials with Shrinkage, transverse of 0.2 %	SABIC method \| 3.2 mm

Technological properties

Property
Application areas	Data Management
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 90 to 110.0°C Drying Time: 3 to 5.0hrs Melt Temperature: 280 to 320.0°C Nozzle Temperature: 280 to 320.0°C Front - Zone 3 Temperature: 280 to 320.0°C Middle - Zone 2 Temperature: 280 to 320.0°C Rear - Zone 1 Temperature: 250 to 280.0°C Mold Temperature: 90 to 120.0°C Back Pressure: 1 to 5.0MPa Screw Speed: 30 to 100.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.