General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.06 g/cm³ Show Supplier Material materials with Density of 1.06 g/cm³ | ASTM D 792 |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elongation | 23.0 °C | 0.5 % Show Supplier Material materials with Elongation of 0.5 % | ASTM D 638 | break |
Flexural modulus | 23.0 °C | 11 GPa Show Supplier Material materials with Flexural modulus of 11 GPa | ASTM D 790 |
Flexural strength | 23.0 °C | 85 MPa Show Supplier Material materials with Flexural strength of 85 MPa | ASTM D 790 |
Impact strength, Izod notched | 23.0 °C | 58 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 58 kJ/m² | ASTM D 256 | notched, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 41 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 41 J/m | ASTM D 256 | notched, 23°C |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 213 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 213 J/m | ASTM D 4812 | 23°C |
Tensile strength | 23.0 °C | 59 MPa Show Supplier Material materials with Tensile strength of 59 MPa | ASTM D 638 | break |
Technological properties
Property | ||
---|---|---|
Application areas | Personal Computing | |
Availability | Asia,Americas | |
Processing methods | Back Pressure: 0.2 to 0.3MPa | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |