General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.46 g/cm³ Show Supplier Material materials with Density of 1.46 g/cm³ | ASTM D 792 |
Moisture absorption | 23.0 °C | 0.27 % Show Supplier Material materials with Moisture absorption of 0.27 % | ISO 62 | (23°C / 50% RH) |
Relative density | 23.0 °C | 1.46 [-] Show Supplier Material materials with Relative density of 1.46 [-] | ASTM D 792 | |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 4.3 GPa Show Supplier Material materials with Elastic modulus of 4.3 GPa | ISO 527 | 1 mm/min |
Elongation | 23.0 °C | 4.3 % Show Supplier Material materials with Elongation of 4.3 % | ISO 527 | break, 5 mm/min |
Flexural modulus | 23.0 °C | 4.3 GPa Show Supplier Material materials with Flexural modulus of 4.3 GPa | ISO 178 | 2 mm/min |
Flexural strength | 23.0 °C | 155 MPa Show Supplier Material materials with Flexural strength of 155 MPa | ISO 178 |
Impact strength, Izod notched | 23.0 °C | 5 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 5 kJ/m² | ISO 180/1A | 80*10*4, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 34 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 34 J/m | ASTM D 256 |
Impact strength, Izod unnotched | 23.0 °C | 33 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 33 kJ/m² | ISO 180/1U | 80*10*4, 23°C |
Impact strength, Izod unnotched, ASTM | 23.0 °C | 485 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 485 J/m | ASTM D 4812 | 23°C |
Instrumented Impact, Total Energy | 23.0 °C | 7 J Show Supplier Material materials with Instrumented Impact, Total Energy of 7 J | ASTM D 3763 | 23°C |
Tensile strength | 23.0 °C | 98 MPa Show Supplier Material materials with Tensile strength of 98 MPa | ISO 527 | break, 5 mm/min |
Thermal
Property | Temperature | Value | Comment |
---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 4E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 4E-5 1/K | ASTM D 696 | -30°C to 30°C |
Coefficient of thermal expansion, transverse | 23.0 °C | 4.4E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 4.4E-5 1/K | ASTM D 696 | -30°C to 30°C |
Heat deflection temperature | 177 - 194 °C Show Supplier Material materials with Heat deflection temperature of 177 - 194 °C | ||
Heat deflection temperature, 0.45 MPa | 194 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 194 °C | ISO 75/Bf | Flatw 80*10*4 sp=64mm | |
Heat deflection temperature, 1.80 MPa | 177 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 177 °C | ISO 75/Af | Flatw 80*10*4 sp=64mm |
Electrical
Property | Temperature | Value | Comment |
---|---|---|---|
Sheet resistivity, ROA | 23.0 °C | 10 - 1000 Ω Show Supplier Material materials with Sheet resistivity, ROA of 10 - 1000 Ω | ASTM D 257 |
Shielding effectiveness | 23.0 °C | 60 dB Show Supplier Material materials with Shielding effectiveness of 60 dB | SABIC method | @ 2.5mm |
Volume resistivity | 23.0 °C | 89 Ω·cm Show Supplier Material materials with Volume resistivity of 89 Ω·cm | ASTM D 257 |
Rheological Properties
Technological properties
Property | ||
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Application areas | Wireless Communications, Data Transfer | |
Availability | Europe,Asia,Americas | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |