LNP™ STAT-LOY™ Compound YX02589C

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Description

LNP STAT-LOY YX02589C is a compound based on Polyester Elastomer resin containing proprietary fillers. Added features of this grade include: Antistatic, Clean Compounding System

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.086 g/cm³

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ASTM D 792

Moisture absorption

23.0 °C

8.5 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.08 [-]

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

0 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

161.7 %

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ISO 527 | yield, 5 mm/min

Flexural modulus

23.0 °C

0 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

2 MPa

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ISO 178

Instrumented Impact, Total Energy

23.0 °C

18 J

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ASTM D 3763 | 23°C

Tensile strength

23.0 °C

6 MPa

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ISO 527 | yield, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

2.45E-4 1/K

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ASTM D 696 | -30°C to 30°C

Coefficient of thermal expansion, transverse

23.0 °C

2.89E-4 1/K

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ASTM D 696 | -30°C to 30°C

Electrical

PropertyTemperatureValueComment

Sheet resistivity, ROA

23.0 °C

1.00E+10 - 1.00E+13 Ω

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ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.61 %

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ASTM D 955 | 24 hrs

Shrinkage, transverse

23.0 °C

0.65 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Semiconductor, Data Management

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 80°C
Drying Time: 4hrs
Maximum Moisture Content: 0.1%
Melt Temperature: 215 to 240.0°C
Front - Zone 3 Temperature: 225 to 240.0°C
Middle - Zone 2 Temperature: 205 to 215.0°C
Rear - Zone 1 Temperature: 180 to 195.0°C
Mold Temperature: 25 to 55.0°C
Back Pressure: 0.2 to 0.3MPa
Screw Speed: 30 to 60.0rpm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.