LEXAN™ Copolymer FXE1414L - Americas

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Description

Opaque EXL, UV-Stabilized & light shielding capability (Wall thickness >0.8mm), for portable electronics device enclosure application. Only available in white, grey and limited pastel colors. Consult CIC or PM for color availability & limitation.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.28 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.07 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.28 [-]

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ASTM D 792

Water absorption

23.0 °C

0.17 %

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ISO 62-1 | (23°C/saturated)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

75 %

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ISO 527 | break, 50 mm/min

Flexural modulus

23.0 °C

2.1 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

83 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Izod notched

23.0 °C

56 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

766 J/m

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ASTM D 256

Instrumented Impact, Total Energy

23.0 °C

68 J

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ASTM D 3763 | 23°C

Tensile strength

23.0 °C

47 MPa

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ISO 527 | break, 50 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

7.02E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

8.23E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Heat deflection temperature

118 °C

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Heat deflection temperature, 1.80 MPa

118 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Vicat softening temperature

138 °C

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ISO 306 | Rate B/50

Flammability

UL Recognized, 94HB Flame Class Rating: 0.4mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=642296- -

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

11 g/10min

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ASTM D 1238 | 300°C/1.2 kgf

Melt volume-flow rate

10 cm³/10min

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ISO 1133 | MVR at 300°C/1.2 kg

Shrinkage

23.0 °C

0.4 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Electronic Components, Enclosures, Forward Lighting, Document Handling, Data Transfer, Data Management, Wireless Communications, Wearables, Tray, Personal Computing, Photo/Video Camera, Power Manangement, Rear/Signal Lighting, Semiconductor

Availability

Europe,Asia,Americas

Processing methods

Rear - Zone 1 Temperature: 260 to 280.0°C
Drying Time: 3 to 4.0hrs
Nozzle Temperature: 290 to 310.0°C
Mold Temperature: 70 to 95.0°C
Middle - Zone 2 Temperature: 280 to 305.0°C
Drying Temperature: 120°C
Hopper Temperature: 60 to 80.0°C
Front - Zone 3 Temperature: 295 to 315.0°C
Maximum Moisture Content: 0.02%
Melt Temperature: 295 to 315.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.