General
Property | Temperature | Value | Comment |
---|---|---|---|
Relative density | 23.0 °C | 1.31 [-] Show Supplier Material materials with Relative density of 1.31 [-] | ASTM D 792 | |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elongation | 23.0 °C | 4 % Show Supplier Material materials with Elongation of 4 % | SABIC - Japan Method | break |
Flexural modulus | 23.0 °C | 3.7 GPa Show Supplier Material materials with Flexural modulus of 3.7 GPa | ASTM D 790 |
Flexural strength | 23.0 °C | 127 MPa Show Supplier Material materials with Flexural strength of 127 MPa | ASTM D 790 |
Impact strength, Izod notched | 23.0 °C | 29 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 29 kJ/m² | ASTM D 256 | notched, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 29 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 29 J/m | ASTM D 256 |
Tensile strength | 23.0 °C | 84 MPa Show Supplier Material materials with Tensile strength of 84 MPa | SABIC - Japan Method | yield |
Thermal
Electrical
Property | Temperature | Value | Comment |
---|---|---|---|
Sheet resistivity, ROA | 23.0 °C | 1.00E+10 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+10 Ω | ASTM D 257 |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Shrinkage | 23.0 °C | 0.5 % Show Supplier Material materials with Shrinkage of 0.5 % | SABIC method | 3.2 mm |
Technological properties
Property | ||
---|---|---|
Application areas | Semiconductor | |
Availability | Europe,Asia,Americas | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |