LNP™ COLORCOMP™ Compound J1000Z-WH9G618

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Description

LNP* COLORCOMP* J1000-WH9G618 is a compound based on Polyethersulfone resin. Added Features include; Extrusion Grade, Customer specific color.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.38 g/cm³ Show Supplier Material materials with Density of 1.38 g/cm³	ISO 1183
Water absorption	23.0 °C	0.6 % Show Supplier Material materials with Water absorption of 0.6 %	ISO 62-1 \| (23°C/24hrs)

Mechanical

Property	Temperature	Value	Comment
Elongation	23.0 °C	1.6 % Show Supplier Material materials with Elongation of 1.6 %	ISO 527 \| break, 5 mm/min
Flexural modulus	23.0 °C	2.8 GPa Show Supplier Material materials with Flexural modulus of 2.8 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	131 MPa Show Supplier Material materials with Flexural strength of 131 MPa	ISO 178 \| yield, 2 mm/min
Impact strength, Izod notched	23.0 °C	5 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 5 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Tensile strength	23.0 °C	85 MPa Show Supplier Material materials with Tensile strength of 85 MPa	ISO 527 \| yield, 5 mm/min
Impact strength, Izod unnotched	ISO 180/1U \| unnotched 80104, 23°C

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	5.8E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 5.8E-5 1/K	ISO 11359-2 \| 23°C to 60°C
Coefficient of thermal expansion, transverse	23.0 °C	6.2E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 6.2E-5 1/K	ISO 11359-2 \| 23°C to 60°C

Rheological Properties

Property	Temperature	Value	Comment
Shrinkage	23.0 °C	0.6 % Show Supplier Material materials with Shrinkage of 0.6 %	SABIC method

Technological properties

Property
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 120 to 150.0°C Drying Time: 4hrs Maximum Moisture Content: 0.05% Melt Temperature: 355 to 370.0°C Front - Zone 3 Temperature: 370 to 380.0°C Middle - Zone 2 Temperature: 360 to 370.0°C Rear - Zone 1 Temperature: 345 to 355.0°C Mold Temperature: 140 to 150.0°C Back Pressure: 0.3 to 0.7MPa Screw Speed: 60 to 100.0rpm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.