LNP™ THERMOCOMP™ Compound DX11354X

Want to keep this datasheet? Save it now in your required format

Description

LNP THERMOCOMP Compound DX11354X is a colorable PC based compound with stable plating and RF performance, colored LDS material solution, good surface and processing window, high impact strength. It is a general purpose product available in internal and external parts for Laser Direct Structuring applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

See where falls on the material property chart for against in your materials selection and design process. Our Ashby charts are interactive with more technical data upon clicking. Sign up to get access to this premium feature for free.

All categories

Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electrical Engineering

Electronics

Display Devices

Materials by this supplier

LNP™ THERMOCOMP™ Compound WF006H

LNP™ THERMOCOMP™ Compound PF00C - Europe

LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

See all materials by this supplier

Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.28 g/cm³ Show Supplier Material materials with Density of 1.28 g/cm³	ISO 1183
Moisture absorption	23.0 °C	0.05 % Show Supplier Material materials with Moisture absorption of 0.05 %	ISO 62 \| (23°C / 50% RH)

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	2.3 GPa Show Supplier Material materials with Elastic modulus of 2.3 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	5 % Show Supplier Material materials with Elongation of 5 %	ISO 527 \| yield, 50 mm/min
Flexural modulus	23.0 °C	2.5 GPa Show Supplier Material materials with Flexural modulus of 2.5 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	86 MPa Show Supplier Material materials with Flexural strength of 86 MPa	ISO 178 \| yield, 2 mm/min
Impact strength, Izod notched	23.0 °C	60 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 60 kJ/m²	ISO 180/1A \| 80103, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	700 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 700 J/m	ASTM D 256 \| notched, 23°C
Tensile strength	23.0 °C	51 MPa Show Supplier Material materials with Tensile strength of 51 MPa	ISO 527 \| break, 50 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	6.5E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 6.5E-5 1/K	ASTM E 831 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	7.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7.1E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		117 °C Show Supplier Material materials with Heat deflection temperature of 117 °C
Heat deflection temperature, 1.80 MPa		117 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 117 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Relative temperature index, electrical		80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C	UL 746B
Relative temperature index, mechanical impact		80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C	UL 746B
Relative temperature index, mechanical strength		80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C	UL 746B
Vicat softening temperature		136 °C Show Supplier Material materials with Vicat softening temperature of 136 °C	ISO 306 \| Rate B/50
Flammability	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101474809- - <br> UL Recognized, 94HB Flame Class Rating: ≥1mm UL 94

Electrical

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	3.03 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.03 [-]	ASTM D 150
Dissipation factor, 1GHz	23.0 °C	6.6E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 6.6E-3 [-]	ASTM D 150
Sheet resistivity, ROA	23.0 °C	1.00E+16 Ω Show Supplier Material materials with Sheet resistivity, ROA of 1.00E+16 Ω	ASTM D 257
Volume resistivity	23.0 °C	1.00E+16 Ω·cm Show Supplier Material materials with Volume resistivity of 1.00E+16 Ω·cm	ASTM D 257

Rheological Properties

Property	Temperature	Value	Comment
Melt volume-flow rate		20 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 20 cm³/10min	ISO 1133 \| MVR at 300°C/1.2 kg
Shrinkage	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage of 0.5 %	ISO 294 \| 24 hrs
Shrinkage, transverse	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage, transverse of 0.5 %	ISO 294 \| 24 hrs

Technological properties

Property
Application areas	Antenna, Enclosures, Wireless Communications, Wearables, Watch/Jewelry, Personal Computing
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 110 to 120.0°C Drying Time: 2 to 4.0hrs Maximum Moisture Content: 0.02% Melt Temperature: 260 to 280.0°C Nozzle Temperature: 255 to 275.0°C Front - Zone 3 Temperature: 260 to 280.0°C Middle - Zone 2 Temperature: 260 to 280.0°C Rear - Zone 1 Temperature: 245 to 265.0°C Hopper Temperature: 40 to 60.0°C Mold Temperature: 80 to 140.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.