LNP™ THERMOCOMP™ Compound DX11355

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Description

This is a PC based compound with good plating, surface, mechanical performance and flame retardant (Halogen free), a good candidate for Laser Direct Structuring applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

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Applications

Electrical Engineering

Electronics

Display Devices

Construction

Lighting

Materials by this supplier

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LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

See all materials by this supplier

Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.27 g/cm³ Show Supplier Material materials with Density of 1.27 g/cm³	ASTM D 792
Moisture absorption	23.0 °C	0.01 % Show Supplier Material materials with Moisture absorption of 0.01 %	ASTM D 570 \| (23°C/50% RH/24 hrs)

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	2.6 GPa Show Supplier Material materials with Elastic modulus of 2.6 GPa	ASTM D 638 \| 50 mm/min
Elongation	23.0 °C	70 % Show Supplier Material materials with Elongation of 70 %	ASTM D 638 \| brk, Type I, 50 mm/min
Flexural modulus	23.0 °C	2.4 GPa Show Supplier Material materials with Flexural modulus of 2.4 GPa	ASTM D 790 \| 1.3 mm/min, 50 mm span
Flexural strength	23.0 °C	89 MPa Show Supplier Material materials with Flexural strength of 89 MPa	ASTM D 790 \| brk, 1.3 mm/min, 50 mm span
Impact strength, Izod notched	23.0 °C	800 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 800 kJ/m²	ASTM D 256 \| notched, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	800 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 800 J/m	ASTM D 256
Tensile strength	23.0 °C	52 MPa Show Supplier Material materials with Tensile strength of 52 MPa	ASTM D 638 \| brk, Type I, 50 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	6.2E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 6.2E-5 1/K	ASTM E 831 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	6.7E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 6.7E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		114 °C Show Supplier Material materials with Heat deflection temperature of 114 °C
Heat deflection temperature, 1.80 MPa		114 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 114 °C	ASTM D 648 \| 3.2mm, unannealed
Relative temperature index, electrical		80 °C Show Supplier Material materials with Relative temperature index, electrical of 80 °C	UL 746B
Relative temperature index, mechanical impact		80 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 80 °C	UL 746B
Relative temperature index, mechanical strength		80 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 80 °C	UL 746B
Flammability	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101214685- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.6mm UL 94

Electrical

Property	Temperature	Value	Comment
Dielectric constant, 1GHz	23.0 °C	2.92 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 2.92 [-]	IEC 60250
Dissipation factor, 1GHz	23.0 °C	7E-3 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 7E-3 [-]	IEC 60250

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		12 g/10min Show Supplier Material materials with Melt mass-flow rate of 12 g/10min	ASTM D 1238 \| 300°C/1.2 kgf
Shrinkage	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage of 0.5 %	ASTM D 955 \| 24 hrs
Shrinkage, transverse	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage, transverse of 0.5 %	ASTM D 955 \| 24 hrs

Technological properties

Property
Application areas	Personal Computing, LED Lighting, Wearables, Wireless Communications, Enclosures, EV Infrastructure, Antenna, Data Transfer
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 100 to 110.0°C Drying Time: 3 to 4.0hrs Drying Time (Cumulative): 8hrs Maximum Moisture Content: 0.02% Melt Temperature: 275 to 300.0°C Nozzle Temperature: 275 to 300.0°C Front - Zone 3 Temperature: 260 to 300.0°C Middle - Zone 2 Temperature: 255 to 295.0°C Rear - Zone 1 Temperature: 250 to 290.0°C Hopper Temperature: 60 to 80.0°C Mold Temperature: 60 to 90.0°C Back Pressure: 0.3 to 0.7MPa Screw Speed: 40 to 70.0rpm Shot to Cylinder Size: 30 to 80.0% Vent Depth: 0.038 to 0.076mm
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.