LNP™ THERMOCOMP™ Compound DX06313

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Description

Polycarbonate base, 30% glass fiber reinforced, impact modified material. Thinwall housing, mobile phone. Some light color grades may have lower impact data than nature and black grade.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.42 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.1 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.42 [-]

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ASTM D 792

Water absorption

23.0 °C

0.4 %

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ISO 62-1 | (23°C/saturated)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

7.4 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

3.5 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

6.7 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

170 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Charpy notched

23.0 °C

15 kJ/m²

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ISO 179/1eA | V-notch Edgew 80*10*4 sp=62mm, 23°C

Impact strength, Izod notched

23.0 °C

16 kJ/m²

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ISO 180/1A | notched 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

120 J/m

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ASTM D 256

Instrumented Impact, Total Energy

23.0 °C

24 J

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ASTM D 3763 | 23°C

Tensile strength

23.0 °C

90 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

2.2E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

6.8E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Heat deflection temperature

136 °C

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Heat deflection temperature, 1.80 MPa

136 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Vicat softening temperature

143 °C

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ISO 306 | Rate B/120

Flammability

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101284061- - <br> UL Recognized, 94HB Flame Class Rating: 1.6mm UL 94

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

42 g/10min

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ASTM D 1238 | 300°C/5.0 kgf

Melt volume-flow rate

32 cm³/10min

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ISO 1133 | MVR at 300°C/5.0 kg

Shrinkage

23.0 °C

0.3 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Wireless Communications, Enclosures

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 48hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 315 to 340.0°C
Nozzle Temperature: 310 to 330.0°C
Front - Zone 3 Temperature: 315 to 340.0°C
Middle - Zone 2 Temperature: 305 to 325.0°C
Rear - Zone 1 Temperature: 295 to 315.0°C
Mold Temperature: 80 to 115.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.