LNP™ THERMOCOMP™ Compound ZKC08

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Description

LNP™ Thermocomp™ ZKC08 is a compound based on PPO resin containing Mineral Filler, Impact Modifier. Added features of this material include: high dielectric constant (Dk), extremely low dissipation factor (Df), good ductility, and good thermal performance.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Applications

Electrical Engineering

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.43 g/cm³ Show Supplier Material materials with Density of 1.43 g/cm³	ASTM D 792
Water absorption	23.0 °C	0.03 % Show Supplier Material materials with Water absorption of 0.03 %	ISO 62-1 \| (23°C/24hrs)

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	2.1 GPa Show Supplier Material materials with Elastic modulus of 2.1 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	9.3 % Show Supplier Material materials with Elongation of 9.3 %	ISO 527 \| break, 50 mm/min
Flexural modulus	23.0 °C	2.2 GPa Show Supplier Material materials with Flexural modulus of 2.2 GPa	ISO 178 \| 2 mm/min
Flexural strength	23.0 °C	72 MPa Show Supplier Material materials with Flexural strength of 72 MPa	ISO 178 \| yield, 2 mm/min
Impact strength, Izod notched	23.0 °C	21 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 21 kJ/m²	ISO 180/1A \| 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	205 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 205 J/m	ASTM D 256
Tensile strength	23.0 °C	42 MPa Show Supplier Material materials with Tensile strength of 42 MPa	ISO 527 \| break, 50 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	6.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 6.1E-5 1/K	ASTM E 831 \| -40°C to 150°C
Coefficient of thermal expansion, transverse	23.0 °C	8.3E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 8.3E-5 1/K	ASTM E 831 \| -40°C to 150°C
Heat deflection temperature		149 - 174 °C Show Supplier Material materials with Heat deflection temperature of 149 - 174 °C
Heat deflection temperature, 0.45 MPa		174 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 174 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		149 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 149 °C	ISO 75/Af \| Flatw 80104 sp=64mm
Relative temperature index, electrical		65 °C Show Supplier Material materials with Relative temperature index, electrical of 65 °C	UL 746B
Relative temperature index, mechanical impact		65 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 65 °C	UL 746B
Relative temperature index, mechanical strength		65 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 65 °C	UL 746B
Flammability	UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=102468956- - <br> UL Recognized, 94HB Flame Class Rating: 1mm UL 94

Electrical

Property	Temperature	Value	Comment
Dielectric constant	23.0 °C	3.93 [-] Show Supplier Material materials with Dielectric constant of 3.93 [-]	SABIC method \| 1.9 GHz
Dielectric constant, 10GHz	23.0 °C	3.93 [-] Show Supplier Material materials with Dielectric constant, 10GHz of 3.93 [-]	SABIC method
Dielectric constant, 1GHz	23.0 °C	3.91 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.91 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	3.95 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.95 [-]	SABIC method
Dissipation factor	23.0 °C	1.2E-3 [-] Show Supplier Material materials with Dissipation factor of 1.2E-3 [-]	SABIC method
Dissipation factor, 1GHz	23.0 °C	9E-4 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 9E-4 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	1.8E-3 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 1.8E-3 [-]	SABIC method

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		31 g/10min Show Supplier Material materials with Melt mass-flow rate of 31 g/10min	ASTM D 1238 \| 300°C/10 kgf
Melt volume-flow rate		7 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 7 cm³/10min	ISO 1133 \| MVR at 300°C/5.0 kg
Shrinkage	23.0 °C	0.75 % Show Supplier Material materials with Shrinkage of 0.75 %	ASTM D 955 \| 24 hrs
Shrinkage, transverse	23.0 °C	0.75 % Show Supplier Material materials with Shrinkage, transverse of 0.75 %	ASTM D 955 \| 24 hrs

Technological properties

Property
Application areas	Wireless Communications
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 105°C Drying Time: 3 to 5.0hrs Melt Temperature: 285 to 295.0°C Nozzle Temperature: 280 to 295.0°C Front - Zone 3 Temperature: 285 to 305.0°C Middle - Zone 2 Temperature: 280 to 295.0°C Rear - Zone 1 Temperature: 275 to 285.0°C Mold Temperature: 90°C Back Pressure: 9MPa Screw Speed: 100rpm
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