LNP™ THERMOCOMP™ Compound DX13354

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Description

LNP* Thermocomp* DX13354 compound is a 30% glass fiber reinforced, impact modified PC resin based LDS material solution with stable plating and RF performance. Good surface aesthetics and wide processing window makes it a good candidate for internal and external parts for Laser Direct Structuring applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Applications

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Properties

General

Property	Temperature	Value	Comment
Relative density	23.0 °C	1.47 [-] Show Supplier Material materials with Relative density of 1.47 [-]	ASTM D 792 \|

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	8.8 GPa Show Supplier Material materials with Elastic modulus of 8.8 GPa	ISO 527 \| 1 mm/min
Elongation	23.0 °C	2.4 % Show Supplier Material materials with Elongation of 2.4 %	ISO 527 \| break, 50 mm/min
Flexural modulus	23.0 °C	8.5 GPa Show Supplier Material materials with Flexural modulus of 8.5 GPa	ISO 178
Flexural strength	23.0 °C	180 MPa Show Supplier Material materials with Flexural strength of 180 MPa	ISO 178
Impact strength, Charpy notched	23.0 °C	14 kJ/m² Show Supplier Material materials with Impact strength, Charpy notched of 14 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Charpy unnotched	23.0 °C	50 kJ/m² Show Supplier Material materials with Impact strength, Charpy unnotched of 50 kJ/m²	ISO 179/2C \| 23°C
Impact strength, Izod notched	23.0 °C	14 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 14 kJ/m²	ISO 180/1A \| notched 80104, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	150 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 150 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched	23.0 °C	40 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 40 kJ/m²	ISO 180/1U \| unnotched 80104
Impact strength, Izod unnotched, ASTM	23.0 °C	700 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 700 J/m	ASTM D 4812 \| 23°C
Tensile strength	23.0 °C	120 MPa Show Supplier Material materials with Tensile strength of 120 MPa	ISO 527 \| break, 50 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	2.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	7.1E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7.1E-5 1/K	ISO 11359-2 \| -40°C to 40°C
Heat deflection temperature		124 - 127 °C Show Supplier Material materials with Heat deflection temperature of 124 - 127 °C
Heat deflection temperature, 0.45 MPa		127 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 127 °C	ISO 75/Bf \| Flatw 80104 sp=64mm
Heat deflection temperature, 1.80 MPa		124 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 124 °C	ISO 75/Af \| Flatw 80104 sp=64mm

Electrical

Property	Temperature	Value	Comment
Dielectric constant	23.0 °C	3.44 [-] Show Supplier Material materials with Dielectric constant of 3.44 [-]	SABIC method \| 1.9 GHz
Dielectric constant, 1GHz	23.0 °C	3.52 [-] Show Supplier Material materials with Dielectric constant, 1GHz of 3.52 [-]	SABIC method \| 1.1 GHz
Dielectric constant, 5GHz	23.0 °C	3.51 [-] Show Supplier Material materials with Dielectric constant, 5GHz of 3.51 [-]	SABIC method
Dissipation factor	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor of 0.01 [-]	SABIC method
Dissipation factor, 1GHz	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor, 1GHz of 0.01 [-]	SABIC method \|
Dissipation factor, 5GHz	23.0 °C	0.01 [-] Show Supplier Material materials with Dissipation factor, 5GHz of 0.01 [-]	SABIC method

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		10 g/10min Show Supplier Material materials with Melt mass-flow rate of 10 g/10min	ASTM D 1238 \| 280°C/2.16 kgf
Melt volume-flow rate		13 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 13 cm³/10min	ASTM D 1238 \| MVR at 300°C/1.2 kg
Shrinkage	23.0 °C	0.05 % Show Supplier Material materials with Shrinkage of 0.05 %	SABIC method \| 3.2 mm
Shrinkage, transverse	23.0 °C	0.2 % Show Supplier Material materials with Shrinkage, transverse of 0.2 %	SABIC method \| 3.2 mm

Technological properties

Property
Application areas	Antenna
Availability	Europe,Asia,Americas
Processing methods	Drying Temperature: 110°C Drying Time: 3 to 4.0hrs Melt Temperature: 270 to 295.0°C Nozzle Temperature: 270 to 295.0°C Front - Zone 3 Temperature: 270 to 295.0°C Middle - Zone 2 Temperature: 270 to 295.0°C Rear - Zone 1 Temperature: 270 to 295.0°C Mold Temperature: 100 to 120.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.