General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.4 g/cm³ Show Supplier Material materials with Density of 1.4 g/cm³ | ISO 1183 |
Moisture absorption | 23.0 °C | 0.06 % Show Supplier Material materials with Moisture absorption of 0.06 % | ISO 62 | (23°C / 50% RH) |
Relative density | 23.0 °C | 1.4 [-] Show Supplier Material materials with Relative density of 1.4 [-] | ASTM D 792 | |
Water absorption | 23.0 °C | 0.2 % Show Supplier Material materials with Water absorption of 0.2 % | ISO 62-1 | (23°C/saturated) |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 11.3 GPa Show Supplier Material materials with Elastic modulus of 11.3 GPa | ISO 527 | 1 mm/min |
Elongation | 23.0 °C | 1.8 % Show Supplier Material materials with Elongation of 1.8 % | ISO 527 | break, 5 mm/min |
Flexural modulus | 23.0 °C | 9.5 GPa Show Supplier Material materials with Flexural modulus of 9.5 GPa | ISO 178 | 2 mm/min |
Flexural strength | 23.0 °C | 195 MPa Show Supplier Material materials with Flexural strength of 195 MPa | ISO 178 | break, 2 mm/min |
Impact strength, Izod notched | 23.0 °C | 108 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 108 kJ/m² | ASTM D 256 | notched, 23°C |
Impact strength, Izod notched, ASTM | 23.0 °C | 108 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 108 J/m | ASTM D 256 |
Impact strength, Izod unnotched | 23.0 °C | 30 kJ/m² Show Supplier Material materials with Impact strength, Izod unnotched of 30 kJ/m² | ISO 180/1U | unnotched 80*10*4, -30°C |
Instrumented Impact, Total Energy | 23.0 °C | 18 J Show Supplier Material materials with Instrumented Impact, Total Energy of 18 J | ASTM D 3763 | 23°C |
Tensile strength | 23.0 °C | 155 MPa Show Supplier Material materials with Tensile strength of 155 MPa | ISO 527 | break, 5 mm/min |
Thermal
Property | Temperature | Value | Comment |
---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 2E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 2E-5 1/K | ISO 11359-2 | -40°C to 40°C |
Coefficient of thermal expansion, transverse | 23.0 °C | 7E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7E-5 1/K | ISO 11359-2 | -40°C to 40°C |
Heat deflection temperature | 147 °C Show Supplier Material materials with Heat deflection temperature of 147 °C | ||
Heat deflection temperature, 1.80 MPa | 147 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 147 °C | ISO 75/Af | Flatw 80*10*4 sp=64mm | |
Vicat softening temperature | 152 °C Show Supplier Material materials with Vicat softening temperature of 152 °C | ISO 306 | Rate B/50 |
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Melt mass-flow rate | 10 g/10min Show Supplier Material materials with Melt mass-flow rate of 10 g/10min | ASTM D 1238 | 300°C/5.0 kgf | |
Melt volume-flow rate | 20 cm³/10min Show Supplier Material materials with Melt volume-flow rate of 20 cm³/10min | ISO 1133 | MVR at 300°C/10.0 kg | |
Shrinkage | 23.0 °C | 0.09 % Show Supplier Material materials with Shrinkage of 0.09 % | SABIC method | 3.2 mm |
Technological properties
Property | ||
---|---|---|
Application areas | Pump, Pipe/Fitting | |
Availability | Europe,Asia,Americas | |
Processing methods | Middle - Zone 2 Temperature: 270 to 290.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |