ULTEM™ Resin 2210EPR - Asia

Want to keep this datasheet? Save it now in your required format

Description

20% Glass fiber filled, high flow Polyetherimide (Tg 217C) with internal mold release and enhanced electroplatability. ECO Conforming, UL94 V0 and 5VA listing.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

All categories

Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electrical Engineering

Electronics

Display Devices

Consumer Goods

Domestic Electrical Appliances

Materials by this supplier

LNP™ THERMOCOMP™ Compound WF006H

LNP™ THERMOCOMP™ Compound PF00C - Europe

LNP™ THERMOCOMP™ Compound JF006E - Europe

LEXAN™ Copolymer FXE1414T - Americas

LNP™ ELCRES™ CRX9411

See all materials by this supplier

Properties

General

Property	Temperature	Value	Comment
Relative density	23.0 °C	1.39 [-] Show Supplier Material materials with Relative density of 1.39 [-]	ASTM D 792 \|

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	6.9 GPa Show Supplier Material materials with Elastic modulus of 6.9 GPa	ASTM D 638 \| 5 mm/min
Elongation	23.0 °C	3 % Show Supplier Material materials with Elongation of 3 %	ASTM D 638 \| brk, Type I, 5 mm/min
Flexural modulus	23.0 °C	6.9 GPa Show Supplier Material materials with Flexural modulus of 6.9 GPa	ASTM D 790 \| 2.6 mm/min, 100 mm span
Flexural strength	23.0 °C	206 MPa Show Supplier Material materials with Flexural strength of 206 MPa	ASTM D 790 \| brk, 2.6 mm/min, 100 mm span
Impact strength, Izod notched	23.0 °C	80 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 80 kJ/m²	ASTM D 256 \| notched, 23°C
Impact strength, Izod notched, ASTM	23.0 °C	80 J/m Show Supplier Material materials with Impact strength, Izod notched, ASTM of 80 J/m	ASTM D 256 \| notched, 23°C
Impact strength, Izod unnotched, ASTM	23.0 °C	587 J/m Show Supplier Material materials with Impact strength, Izod unnotched, ASTM of 587 J/m	ASTM D 4812 \| 23°C
Instrumented Impact, Total Energy	23.0 °C	14 J Show Supplier Material materials with Instrumented Impact, Total Energy of 14 J	ASTM D 3763 \| 23°C
Tensile strength	23.0 °C	137 MPa Show Supplier Material materials with Tensile strength of 137 MPa	ASTM D 638 \| brk, Type I, 5 mm/min

Thermal

Property	Temperature	Value	Comment
Coefficient of thermal expansion	23.0 °C	3.6E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion of 3.6E-5 1/K	ASTM E 831 \| -40°C to 40°C
Coefficient of thermal expansion, transverse	23.0 °C	7.2E-5 1/K Show Supplier Material materials with Coefficient of thermal expansion, transverse of 7.2E-5 1/K	ASTM E 831 \| -40°C to 40°C
Heat deflection temperature		206 - 211 °C Show Supplier Material materials with Heat deflection temperature of 206 - 211 °C
Heat deflection temperature, 0.45 MPa		211 °C Show Supplier Material materials with Heat deflection temperature, 0.45 MPa of 211 °C	ASTM D 648 \| 3.2 mm, unannealed
Heat deflection temperature, 1.80 MPa		206 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 206 °C	ASTM D 648 \| 3.2mm, unannealed
Relative temperature index, electrical		105 °C Show Supplier Material materials with Relative temperature index, electrical of 105 °C	UL 746B
Relative temperature index, mechanical impact		105 °C Show Supplier Material materials with Relative temperature index, mechanical impact of 105 °C	UL 746B
Relative temperature index, mechanical strength		105 °C Show Supplier Material materials with Relative temperature index, mechanical strength of 105 °C	UL 746B
Vicat softening temperature		210 °C Show Supplier Material materials with Vicat softening temperature of 210 °C	ASTM D 1525 \| Rate B/50
Flammability	UL Recognized, 94V-0 Flame Class Rating: ≥0.4mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=104152645- -

Electrical

Property	Temperature	Value	Comment
Comparative tracking index	23.0 °C	4 V Show Supplier Material materials with Comparative tracking index of 4 V	UL 746A \| (UL) {PLC}
High Amp Arc Ignition	23.0 °C	0.4 mm Show Supplier Material materials with High Amp Arc Ignition of 0.4 mm	≥, UL 746A \| PLC 4
High Volt Arc Track Rate	23.0 °C	4 PLC Code Show Supplier Material materials with High Volt Arc Track Rate of 4 PLC Code	UL 746A \| (PLC)
Hot-Wire Ignition	23.0 °C	1.5 mm Show Supplier Material materials with Hot-Wire Ignition of 1.5 mm	≥, UL 746A \| PLC 2

Rheological Properties

Property	Temperature	Value	Comment
Melt mass-flow rate		13 g/10min Show Supplier Material materials with Melt mass-flow rate of 13 g/10min	ASTM D 1238 \| 337°C/6.6 kgf
Shrinkage	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage of 0.5 %	SABIC method \| 3.2 mm
Shrinkage, transverse	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage, transverse of 0.5 %	SABIC method \| 3.2 mm

Technological properties

Property
Application areas	Electronic Components, Enclosure/Housing/Cover, Circuit Protection, Semiconductor, Personal Computing, Wire & cable
Availability	Asia,Americas
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.