NORYL GTX™ Resin GTX840 - Asia

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Description

NORYL GTX™ 840 resin is a 40% glass reinforced alloy of Polyphenylene Ether (PPE) + Polyamide (PA). This injection moldable grade has high stiffness (flexural modulus 11860 MPa), excellent chemical resistance, and high heat resistance. NORYL GTX GTX840 resin is an excellent candidate for a wide variety of applications including automotive under-the-hood and water management.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.45 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

1.64 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.45 [-]

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ASTM D 792 |

Water absorption

23.0 °C

0.3 %

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ASTM D 570 | (23°C/Saturated)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

12.6 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

2 %

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ISO 527 | break, 5 mm/min

Flexural modulus

23.0 °C

11.7 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

280 MPa

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ISO 178 | yield, 2 mm/min

Hardness, Rockwell R

23.0 °C

108 [-]

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ASTM D 785

Impact strength, Charpy notched

23.0 °C

11 kJ/m²

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ISO 179/2C | -30°C

Impact strength, Izod notched

23.0 °C

11 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

90 J/m

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ASTM D 256

Tensile strength

23.0 °C

198 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 1/K

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ASTM E 831 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

9E-5 1/K

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ASTM E 831 | -40°C to 40°C

Heat deflection temperature

244 - 258 °C

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Heat deflection temperature, 0.45 MPa

258 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Heat deflection temperature, 1.80 MPa

244 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Vicat softening temperature

246 °C

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ISO 306 | Rate B/50

Rheological Properties

PropertyTemperatureValueComment

Melt volume-flow rate

10 cm³/10min

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ISO 1133 | MVR at 220°C/5.0 kg

Shrinkage

23.0 °C

0.24 %

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SABIC method | 3.2 mm

Shrinkage, transverse

23.0 °C

0.6 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

EV Infrastructure, Electronic Components, Transmission/Transfer Comp, Personal Computing

Availability

Europe,Asia,Americas

Processing methods

Drying Time: 3 to 4.0hrs
Minimum Moisture Content: 0.02%
Back Pressure: 0.3 to 1.4MPa
Drying Time (Cumulative): 8hrs
Middle - Zone 2 Temperature: 280 to 315.0°C
Melt Temperature: 295 to 315.0°C
Drying Temperature: 95 to 105.0°C
Rear - Zone 1 Temperature: 275 to 315.0°C
Nozzle Temperature: 295 to 315.0°C
Screw Speed: 20 to 100.0rpm
Mold Temperature: 75 to 120.0°C
Front - Zone 3 Temperature: 290 to 315.0°C
Shot to Cylinder Size: 30 to 50.0%
Vent Depth: 0.013 to 0.038mm
Maximum Moisture Content: 0.07%

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.