General
Property | Temperature | Value | Comment |
---|---|---|---|
Density | 23.0 °C | 1.41 g/cm³ Show Supplier Material materials with Density of 1.41 g/cm³ | ASTM D 792 |
Mechanical
Property | Temperature | Value | Comment |
---|---|---|---|
Elastic modulus | 23.0 °C | 9.6 GPa Show Supplier Material materials with Elastic modulus of 9.6 GPa | ASTM D 638 | 50 mm/min |
Elongation | 23.0 °C | 2.9 % Show Supplier Material materials with Elongation of 2.9 % | ASTM D 638 | break |
Flexural modulus | 23.0 °C | 7.1 GPa Show Supplier Material materials with Flexural modulus of 7.1 GPa | ASTM D 790 |
Flexural strength | 23.0 °C | 206 MPa Show Supplier Material materials with Flexural strength of 206 MPa | ASTM D 790 |
Impact strength, Izod notched | 23.0 °C | 112 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 112 kJ/m² | ASTM D 256 | notched, 23°C |
Tensile strength | 23.0 °C | 155 MPa Show Supplier Material materials with Tensile strength of 155 MPa | ASTM D 638 | break |
Thermal
Rheological Properties
Property | Temperature | Value | Comment |
---|---|---|---|
Shrinkage | 23.0 °C | 0.3 % Show Supplier Material materials with Shrinkage of 0.3 % | ASTM D 955 | 24 hrs |
Technological properties
Property | ||
---|---|---|
Application areas | Photovoltaic Components | |
Availability | Europe,Asia,Americas | |
Processing methods | Rear - Zone 1 Temperature: 265 to 275.0°C | |
Supplier Disclaimer | While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right. |