LEXAN™ FR Resin BM5225Y - Asia

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Description

LEXAN™ BM5225Y Polycarbonate resin is an injection moldable non chlorinated/brominated mineral-filled flame retardant grade. It features high modulus, good flow, ductility and low warpage. It has a UL94 V0@1.5mm and 5VB@1.5mm flame rating and is a good candidate for thin wall applications.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.4 g/cm³

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ISO 1183

Relative density

23.0 °C

1.39 [-]

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

5.6 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

2.8 %

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ISO 527 | yield, 5 mm/min

Flexural modulus

23.0 °C

6.2 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

98 MPa

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ISO 178 | yield, 2 mm/min

Hardness, Rockwell R

23.0 °C

109 [-]

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ASTM D 785

Impact strength, Charpy notched

23.0 °C

6 kJ/m²

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ISO 179/1eA | V-notch Edgew, 23°C, 80*10*4 sp=62mm

Impact strength, Izod notched

23.0 °C

50 kJ/m²

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ASTM D 256 | notched, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

50 J/m

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ASTM D 256

Instrumented Impact, Total Energy

23.0 °C

20 J

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ASTM D 3763 | 23°C

Tensile strength

23.0 °C

30 MPa

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ISO 527 | break, 5 mm/min

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

3.4E-5 1/K

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ISO 11359-2 | 23°C to 80°C

Coefficient of thermal expansion, transverse

23.0 °C

6.9E-5 1/K

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ISO 11359-2 | 23°C to 80°C

Heat deflection temperature

87 - 93 °C

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Heat deflection temperature, 0.45 MPa

93 °C

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ASTM D 648 | 3.2 mm, unannealed

Heat deflection temperature, 1.80 MPa

87 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Relative temperature index, electrical

80 °C

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UL 746B

Relative temperature index, mechanical impact

80 °C

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UL 746B

Relative temperature index, mechanical strength

80 °C

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UL 746B

Vicat softening temperature

98 °C

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ASTM D 1525 | Rate B/50

Flammability

UL Recognized, 94V-0 Flame Class Rating: ≥1.2mm UL 94 <br> UL Recognized, 94-5VB Flame Class Rating: ≥1.5mm UL 94 <br> UL Recognized, 94V-1 Flame Class Rating: ≥0.8mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101901446- -

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

12 g/10min

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ASTM D 1238 | 260°C/2.16 kgf

Shrinkage

23.0 °C

0.3 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Personal Computing, Data Management

Availability

Asia

Processing methods

Front - Zone 3 Temperature: 270 to 290.0°C
Rear - Zone 1 Temperature: 250 to 270.0°C
Drying Time (Cumulative): 16hrs
Drying Temperature: 90 to 105.0°C
Middle - Zone 2 Temperature: 260 to 280.0°C
Melt Temperature: 270 to 300.0°C
Mold Temperature: 70 to 90.0°C
Drying Time: 4 to 6.0hrs
Nozzle Temperature: 280 to 300.0°C

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.