LNP™ THERMOCOMP™ Compound KF006 - Americas

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Description

LNP THERMOCOMP KF006 is a compound based on Acetal Copolymer resin containing 30% Glass Fiber. Added features of this material include: Chemically Coupled.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Available suppliers

SABIC

MANUFACTURER, PROCESSOR AND DISTRIBUTOR

Additional services:

Our six Global Application Technology development hubs add value to our customers’ entire product development cycles in a wide range of industries. We provide our customers with advanced design, predictive engineering, testing, validation and processing services. Our COLORXPRESS™ services team provides global color matching and maintenance. Our Fast Formulation services provide initial assessments within five business days and custom-made samples typically in four to six weeks.

Applications

Electronics

Display Devices

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Properties

General

Property	Temperature	Value	Comment
Density	23.0 °C	1.62 g/cm³ Show Supplier Material materials with Density of 1.62 g/cm³	ASTM D 792

Mechanical

Property	Temperature	Value	Comment
Elongation	23.0 °C	2.8 % Show Supplier Material materials with Elongation of 2.8 %	ASTM D 638 \| break
Flexural modulus	23.0 °C	10.3 GPa Show Supplier Material materials with Flexural modulus of 10.3 GPa	ASTM D 790
Flexural strength	23.0 °C	213 MPa Show Supplier Material materials with Flexural strength of 213 MPa	ASTM D 790
Impact strength, Izod notched	23.0 °C	85 kJ/m² Show Supplier Material materials with Impact strength, Izod notched of 85 kJ/m²	ASTM D 256 \| notched, 23°C
Tensile strength	23.0 °C	147 MPa Show Supplier Material materials with Tensile strength of 147 MPa	ASTM D 638 \| break

Thermal

Property	Value	Comment
Heat deflection temperature	161 °C Show Supplier Material materials with Heat deflection temperature of 161 °C
Heat deflection temperature, 1.80 MPa	161 °C Show Supplier Material materials with Heat deflection temperature, 1.80 MPa of 161 °C	ASTM D 648 \| 3.2mm, unannealed
Flammability	UL Recognized, 94HB Flame Class Rating: ≥1.5mm UL 94 <br> UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=101284440- -

Rheological Properties

Property	Temperature	Value	Comment
Shrinkage	23.0 °C	0.5 % Show Supplier Material materials with Shrinkage of 0.5 %	ASTM D 955 \| 24 hrs
Shrinkage, transverse	23.0 °C	2 % Show Supplier Material materials with Shrinkage, transverse of 2 %	ASTM D 955 \| 24 hrs

Technological properties

Property
Application areas	Document Handling
Availability	Europe,Americas
Processing methods	Back Pressure: 0.2 to 0.3MPa Melt Temperature: 200 to 215.0°C Mold Temperature: 80 to 110.0°C Screw Speed: 30 to 60.0rpm Front - Zone 3 Temperature: 210 to 220.0°C Drying Time: 4hrs Middle - Zone 2 Temperature: 195 to 205.0°C Drying Temperature: 80°C Rear - Zone 1 Temperature: 175 to 190.0°C
Supplier Disclaimer	While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.