SILTEM™ resin STM1600 - Europe

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Description

SILTEM™ STM1600 resin is a flexible polyetherimide(PEI)-siloxane copolymer designed for wire and cable applications. It offers a halogen free (according VDE 0472) flame retardant solution that also offers low smoke emission and toxicity. It is an amber colored transparent material that can be selfcolored and easily processed on conventional equipment. The material may also have a fit in flexible profiles or injection molded parts.

This material data has been provided by Sabic.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.19 g/cm³

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ISO 1183

Limiting oxygen index

23.0 °C

48 %

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Relative density

23.0 °C

1.19 [-]

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ASTM D 792

Water absorption

23.0 °C

0.58 %

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ISO 62-1 | (23°C/24hrs)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

1.38 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

74 %

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ISO 527 | break, 50 mm/min

Flexural modulus

23.0 °C

1.25 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

55 MPa

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ISO 178 | yield, 2 mm/min

Hardness, Shore D

23.0 °C

72 [-]

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ASTM D 2240

Impact strength, Izod notched

23.0 °C

25 kJ/m²

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ISO 180/1A | 80*10*4, -30°C

Taber Abrasion

23.0 °C

50 mg/1000cy

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ASTM D 1044 | CS-17, 1 kg

Tensile strength

23.0 °C

41 MPa

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ISO 527 | break, 50 mm/min

Thermal

PropertyValueComment

Glass transition temperature

195 °C

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DMA | matrix

Heat deflection temperature, 0.45 MPa

144 °C

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ISO 75/Bf | Flatw 80*10*4 sp=64mm

Vicat softening temperature

167 °C

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ISO 306 | Rate B/120

Flammability

UL Compliant, 94V-0 Flame Class Rating: 1.6mm UL 94 by SABIC-IP

Electrical

PropertyTemperatureValueComment

Dielectric constant, 100Hz

23.0 °C

3.14 [-]

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ASTM D 150

Dielectric constant, 1KHz

23.0 °C

3 [-]

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ASTM D 150

Dielectric constant, 1MHz

23.0 °C

3.02 [-]

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ASTM D 150

Dielectric strength

23.0 °C

16.6 kV/mm

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ASTM D 149 | in oil, 3.2 mm

Dissipation factor, 100Hz

23.0 °C

0.01 [-]

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ASTM D 150

Dissipation factor, 100kHz

23.0 °C

6.4E-3 [-]

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ASTM D 150

Dissipation factor, 1MHz

23.0 °C

5.5E-3 [-]

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ASTM D 150 |

Sheet resistivity, ROA

23.0 °C

1.00E+15 Ω

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>, ASTM D 257

Volume resistivity

23.0 °C

1.00E+16 Ω·cm

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>, ASTM D 257

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

8.6 g/10min

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ASTM D 1238 | 295°C/6.6 kgf

Shrinkage

23.0 °C

0.86 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Fluid Delivery, Enclosure/Housing/Cover, Aerospace, Wire & cable

Availability

Europe,Americas

Features

Low Corrosivity, High Tensile Elongation, Flexible, Chemical Resistance, Low Smoke and Toxicity, High Heat Resistance, Good dimensional stability, Flame Retardant, Non-Halogenated

Processing methods

Drying Time (Cumulative): 8hrs
Melt Temperature: 310 to 320.0°C
Nozzle Temperature: 310 to 320.0°C
Middle - Zone 2 Temperature: 310 to 320.0°C
Front - Zone 3 Temperature: 310 to 320.0°C
Back Pressure: 0.3 to 0.7MPa
Rear - Zone 1 Temperature: 310 to 320.0°C
Screw Speed: 50 to 100.0rpm
Vent Depth: 0.025 to 0.076mm
Mold Temperature: 105 to 115.0°C
Drying Temperature: 105°C
Drying Time: 4 to 6.0hrs
Shot to Cylinder Size: 40 to 60.0%
Maximum Moisture Content: 0.02%

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.