ULTEM™ Resin DH1004 - Asia

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Description

High Temperature, Transparent, Polyetherimide Blend with Improved Ductility and Enhanced Hydrostability.

This material data has been provided by Sabic.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.28 g/cm³

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ISO 1183

Limiting oxygen index

23.0 °C

46 %

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Relative density

23.0 °C

1.28 [-]

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ASTM D 792 |

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.9 GPa

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ASTM D 638 | 5 mm/min

Elongation

23.0 °C

7 %

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ISO 527 | yield, 50 mm/min

Flexural modulus

23.0 °C

2.8 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

136 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Charpy notched

23.0 °C

11 kJ/m²

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ISO 179/2C | 23°C

Impact strength, Izod notched

23.0 °C

6 kJ/m²

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ISO 180/1A | 80*10*4, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

70 J/m

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ASTM D 256

Instrumented Impact Ductility

23.0 °C

90 %

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ASTM D 3763 | -20°C

Instrumented Impact, Total Energy

23.0 °C

88 J

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ASTM D 3763 | -20°C

Tensile strength

23.0 °C

97 MPa

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ISO 527 | yield, 50 mm/min

Impact strength, Izod unnotched

ISO 180/1U | 80*10*4, 23°C

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

5E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Coefficient of thermal expansion, transverse

23.0 °C

5E-5 1/K

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ISO 11359-2 | 23°C to 150°C

Heat deflection temperature, 0.45 MPa

205 °C

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ISO 75/Be | Edgew 120*10*4 sp=100mm

Heat deflection temperature, 1.80 MPa

190 °C

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ISO 75/Ae | Edgew 120*10*4 sp=100mm

Relative temperature index, electrical

105 °C

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UL 746B

Relative temperature index, mechanical impact

105 °C

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UL 746B

Relative temperature index, mechanical strength

105 °C

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UL 746B

Thermal conductivity

23.0 °C

0.19 W/(m·K)

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ASTM C177

Vicat softening temperature

219 °C

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ISO 306 | Rate A/50

Flammability

UL Yellow Card Link: https://iq.ul.com/ul/cert.aspx?ULID=100737020- - <br> UL Recognized, 94V-0 Flame Class Rating: ≥0.75mm UL 94 <br> NBS Smoke Density, Flaming, Ds 4 min: 0.7- ASTM E 662

Electrical

PropertyTemperatureValueComment

Comparative tracking index

23.0 °C

4 V

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UL 746A | (UL) {PLC}

High Amp Arc Ignition

23.0 °C

0.75 mm

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≥, UL 746A | PLC 1

Hot-Wire Ignition

23.0 °C

1.5 mm

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≥, UL 746A | PLC 1

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

10 g/10min

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ASTM D 1238 | 337°C/6.6 kgf

Melt volume-flow rate

14 cm³/10min

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ISO 1133 | MVR at 360°C/5.0 kg

Shrinkage

23.0 °C

0.5 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Weapon, Medical Device, Meter Gas, Data Transfer, Electronic Components

Availability

Europe,Asia,Americas

Features

High Heat Resistance

Processing methods

Drying Temperature: 150°C
Drying Time: 6 to 8.0hrs
Drying Time (Cumulative): 24hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 355 to 390.0°C
Nozzle Temperature: 345 to 390.0°C
Front - Zone 3 Temperature: 345 to 390.0°C
Middle - Zone 2 Temperature: 335 to 390.0°C
Rear - Zone 1 Temperature: 330 to 390.0°C
Mold Temperature: 130 to 160.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.