LEXAN™ Copolymer MPX3 - Asia

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Description

Improved flow PC with excellent processability and mold release.

This material data has been provided by Sabic.

"Typical" values were obtained via a literature search. "Predicted" values were imputed via artificial intelligence technology. While we have placed significant efforts in ensuring data accuracy, "typical" and "predicted" data should be considered indicative and verified by appropriate material testing. Please do contact us if additional information on the the predicted data method is required.
All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.2 g/cm³

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ISO 1183

Moisture absorption

23.0 °C

0.15 %

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ISO 62 | (23°C / 50% RH)

Relative density

23.0 °C

1.2 [-]

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ASTM D 792

Water absorption

23.0 °C

0.35 %

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ISO 62-1 | (23°C/saturated)

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

2.5 GPa

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ISO 527 | 1 mm/min

Elongation

23.0 °C

6 %

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ISO 527 | yield, 50 mm/min

Flexural modulus

23.0 °C

2.3 GPa

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ISO 178 | 2 mm/min

Flexural strength

23.0 °C

71 MPa

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ISO 178 | yield, 2 mm/min

Impact strength, Charpy notched

23.0 °C

65 kJ/m²

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ISO 179/1eA | V-notch Edgew 80*10*3 sp=62mm, 23°C

Impact strength, Izod notched

23.0 °C

11 kJ/m²

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ISO 180/1A | notched 80*10*3, -30°C

Impact strength, Izod notched, ASTM

23.0 °C

242 J/m

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ASTM D 256 | notched, -30°C

Instrumented Impact, Total Energy

23.0 °C

72 J

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ASTM D 3763 | 23°C

Tensile strength

23.0 °C

60 MPa

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ISO 527 | yield, 50 mm/min

Impact strength, Charpy unnotched

ISO 179/1eU | Unnotch Edgew 80*10*3 sp=62mm, 23°C

Impact strength, Izod unnotched

ISO 180/1U | 80*10*3, 23°C

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

6E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Coefficient of thermal expansion, transverse

23.0 °C

6E-5 1/K

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ISO 11359-2 | -40°C to 40°C

Heat deflection temperature

122 °C

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Heat deflection temperature, 1.80 MPa

122 °C

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ISO 75/Af | Flatw 80*10*4 sp=64mm

Vicat softening temperature

140 °C

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ISO 306 | Rate B/120

Rheological Properties

PropertyTemperatureValueComment

Melt mass-flow rate

19.5 g/10min

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ASTM D 1238 | 300°C/1.2 kgf

Melt volume-flow rate

18 cm³/10min

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ISO 1133 | MVR at 220°C/5.0 kg

Shrinkage

23.0 °C

0.4 %

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SABIC method | 3.2 mm

Technological properties

Property
Application areas

Lawn/Garden, Fog Lamp, Forward Lighting, Enclosures, Energy Management, Electronic Components, Auto Aftermarket, Displays, Chocolate Mold, Data Transfer, Wireless Communications, Wiring Devices, Traffic Management, Personal Care, Non-LED Lighting, LED Lighting, Meter Water, Recreational Vehicle, Rear/Signal Lighting

Availability

Europe,Asia,Americas

Processing methods

Drying Temperature: 120°C
Drying Time: 3 to 4.0hrs
Drying Time (Cumulative): 48hrs
Maximum Moisture Content: 0.02%
Melt Temperature: 295 to 315.0°C
Nozzle Temperature: 290 to 310.0°C
Front - Zone 3 Temperature: 295 to 315.0°C
Middle - Zone 2 Temperature: 280 to 305.0°C
Rear - Zone 1 Temperature: 270 to 295.0°C
Mold Temperature: 70 to 95.0°C
Back Pressure: 0.3 to 0.7MPa
Screw Speed: 40 to 70.0rpm
Shot to Cylinder Size: 40 to 60.0%
Vent Depth: 0.025 to 0.076mm

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.