LNP™ THERMOCOMP™ Compound RX06420 - Asia

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Description

LNP THERMOCOMP RX06420 is a compound based on Nylon 66 resin containing 20% Glass Fiber. Added features of this material include: Easy Molding, Low Extractable, Mold Release.

This material data has been provided by Sabic.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

Ashby charts

Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.29 g/cm³

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Flexural modulus

23.0 °C

6.26 GPa

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ASTM D 790

Flexural strength

23.0 °C

161 MPa

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ASTM D 790 | brk, 1.3 mm/min, 50 mm span

Impact strength, Izod notched

23.0 °C

50 kJ/m²

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ASTM D 256 | notched, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

50 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

423 J/m

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ASTM D 4812 | 23°C

Thermal

PropertyValueComment

Heat deflection temperature, 1.80 MPa

221 °C

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ASTM D 648 | 3.2mm, unannealed

Rheological Properties

PropertyTemperatureValueComment

Shrinkage

23.0 °C

0.5 %

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ASTM D 955 | 24 hrs

Technological properties

Property
Application areas

Oil/Gas

Availability

Asia,Americas

Features

High Stiffness, Structural

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.