LNP™ THERMOCOMP™ Compound RFB53XXZ - Asia

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Description

LNP THERMOCOMP RFB53XXZ is a compound based on Nylon 66 resin containing 15% Glass Fiber, 25% Glass Bead.

This material data has been provided by Sabic.

All metrics apply to room temperature unless otherwise stated. SI units used unless otherwise stated.
Equivalent standards are similar to one or more standards provided by the supplier. Some equivalent standards may be stricter whereas others may be outside the bounds of the original standard.

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Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

1.46 g/cm³

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ASTM D 792

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

7.74 GPa

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ASTM D 638 | 50 mm/min

Elongation

23.0 °C

2.7 %

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ASTM D 638 | break

Flexural modulus

23.0 °C

6.99 GPa

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ASTM D 790

Flexural strength

23.0 °C

186 MPa

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ASTM D 790

Impact strength, Izod notched

23.0 °C

26 kJ/m²

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ASTM D 256 | notched, 23°C

Impact strength, Izod notched, ASTM

23.0 °C

26 J/m

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ASTM D 256 | notched, 23°C

Impact strength, Izod unnotched, ASTM

23.0 °C

470 J/m

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ASTM D 4812 | 23°C

Tensile strength

23.0 °C

108 MPa

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ASTM D 638 | break

Thermal

PropertyValueComment

Heat deflection temperature

225 °C

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Heat deflection temperature, 1.80 MPa

225 °C

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ASTM D 648 | 3.2mm, unannealed

Technological properties

Property
Availability

Asia,Americas

Features

Low Warpage, Structural

Supplier Disclaimer

While the information is provided in good faith, SABIC MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING MERCHANTABILITY AND NONINFRINGEMENT OF INTELLECTUAL PROPERTY, NOR ASSUMES ANY LIABILITY, DIRECT OR INDIRECT, WITH RESPECT TO THE PERFORMANCE, SUITABILITY OR FITNESS FOR INTENDED USE OR PURPOSE OF THESE PRODUCTS IN ANY APPLICATION. Each Buyer must determine the suitability of SABIC's materials for the Buyer's particular use through appropriate testing and analysis. No statement by SABIC concerning a possible use of any product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right.